Soldato
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The EK Supremacy defo has an in and an outlet. I am not sure about the Supreme.
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Full loop now cpu is useless?
- Thread starter Techen
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Soldato
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Stating the obvious here, but what is the ambient temperature? You ain't gonna get 20 degrees idle if it's 25 degrees where your pc is 
you need to be comparing delta temperatures.
you need to be comparing delta temperatures.
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which motherboard is that, looks like loads of unused space around the cpu socket lol.
Where's the cpu retention bracket?
Where's the cpu retention bracket?
Delid, So I can't use the bracket else there'd be a gap between the CPU and the cpu block.
Soldato
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It usual practice to clean the black crap of and put on some decent TIM of your choice, liquid metal being most peoples and then lay the lid back on top and clamp it all back down.
It's what and many others have done with our 4770k.
Are you using a shim of sorts so you don't crush the core?
I don't really see the appeal of stuffing the lid back on it really, I may do it when my liquid metal comes through the post but yea.
Even with what I have temps are still kinda high at 75c in prime under 1.22v
Nothing is stopping it being crushed apart from not pushing the block down too hard
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I would put your CPU in the loop first tbh..
Just my 2p, I run basically the same setup, i have found that fans only compensate for poor rad surface area, i run a D5 bay res on setting 2.5 , EX280 + 2 AF140 quiet editions, a EKWB 120 with a AF120 quiet edition and a Phobya Xtreme 200 with a coolermaster megaflow.
My 780ti @ 1270 rarly sees over 40 degrees and my 3770k @ 4.5 hits around 60 degrees on full burn test (de-lid) and idles around 30 degrees.
People here have scoffed at my fan setup but i have tried high static pressure fans and sure they push more air but they make little to no difference to my temps.
All this is in a fully closed corsair 650d and is near silent running.
Top 280 rad is pushing air out through rad , rear 120 is in a pull pulling air into the case and the 200mm at the front is in a pull config and into the case as well.
Hope this helps.
My 780ti @ 1270 rarly sees over 40 degrees and my 3770k @ 4.5 hits around 60 degrees on full burn test (de-lid) and idles around 30 degrees.
People here have scoffed at my fan setup but i have tried high static pressure fans and sure they push more air but they make little to no difference to my temps.
All this is in a fully closed corsair 650d and is near silent running.
Top 280 rad is pushing air out through rad , rear 120 is in a pull pulling air into the case and the 200mm at the front is in a pull config and into the case as well.
Hope this helps.
It won't make a difference, the temperature equalises over the whole loop.
Definitely sounds like a bad mount/contact to me or blocked CPU block
Possibly going off on a tangent but,
Surely the liquid entering a rad is cooler than the liquid exiting the rad, therefore liquid from the rad into the cpu waterblock will be cooler than the liquid from a gpu waterblock?
Theoretically, yes. In practice the coolant flow and the heat conductivity of the radiator (along with heat capacity of the coolant) is such that the difference is negligable, if not impossible to measure.
The cooling loop acts as a single continuous entity, rather than a 'bus' that travels to one section, gets heated up, goes further, cools down, etc.
His cpu block isn't directional
With the liquid passing through the rad before it enters the cpu being cooler than liquid passing through a gpu before the cpu, would cpu cooling efficiency improve thus bringing down the temp of the cpu?
I know this probably isnt the cause of the op's problem, just talking theory and physics.
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It is down to surface area / efficiency of the blocks.
The fluid is at a fairly constant temp depending on the ability of the radiator (read heat exchanger) to dissipate the thermal energy into the air and also the ambient air temperature.
On my system CPU and NB/chipset blocks only for example the NB / chipset reads 5C less than the idle temp of the CPU after running for a while. The NB/chipset block is therefore producing more fin area per watt than the CPU.
EDIT, Like the bare CPU, could never see the point of replacing the lid, reminiscient of old athlon Tbred CPU clocking. You'll only crack the core if you apply uneven contact.
tl;dr fluid temp is pretty constant wherever measured so the variable is the block efficiency per watt on each component.
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