IC-Diamond WATER cooling thread

Can anyone list any water blocks they wish for me to test... only cpu's i have spare atm are intel 775 core i7 920 1336, 4770k 1150 and a 2011 pin 3960x

Can people please VOTE for the Intel socket (intel only sorry AMD folks as I only have intel cpu's in stock) the highest vote for a socket wins and I will proceed using contact/pressure tests under the highest voted socket. Then subject to enough interest I will send the results back to America for in-depth lab tests.

Options are:
INTEL only

a: ) SOCKET 775 6400 core 2 duo
B: ) SOCKET 1366 CORE I7 920
C: ) SOCKET 1150 4770K
D: )SOCKET 2011 3960X

Please vote a: b: c: or d:

The purpose of this test, is to cut through any marketing spiel and to simply test which block works the best for the most voted socket.

Blocks still available are:

Swiftech APOGEE HD
EK Supremecy Full Nickel
KOOLANCE 370 (the highest end space age silver one)
Larkcooler I300

If anyone wishes for me to test with ANY other block, please let me know. Or better yet, if anyone wishes to test on a regular heatsink fan I will include those tests also.

Please note, no thermal results will be included so TIM is not applied! Contact/pressure only:)

Kindest Regards
Frost Dragon
 
Ok bare in mind my first contact results were with a 1366 core i7 950 :) this time i have a core i7 920 so yup it could be worth testing that socket again to see if the trend continues on other cpu's of that socket range:)

However let us see on how the vote goes:)

Kindest Regards

Frost Dragon
 
I would be interested to see the results with the same block, but with a different CPU, I can imagine the IHS would play just as an important factor as the block itself in these tests.
 
frostdragon said:
really? remember the white means no contact/pressure so in essence the Ek was one of the worst contact/pressure tests.
Click to expand...

Having said that, it shows even contact throughout the surface, despite it showing low pressure. With a thin layer of high conductive tim like CLU, you can find even contact which covers the whole IHS will give better temps than other coolers which might focus on a smaller area, like the Lark block.

Like you said, this comparison shows pressure and contact rather than temperature performance. If people want a temp performance test, then block temperature benchmarks using an appropriate chip will serve better. These tend to show the Supremacy up there with other top blocks, despite the low force the contact paper showed. The internal design plays as much part as the block surface too.

Comparison is good and interesting but should not be mistaken for a direct performance comparison.
 
Agreed avenged:) A fair comment indeed

A point i made clear from the get go, i have highlighted this aspect as contact/pressure is one of the most overlooked issues.

Kindest Regards

Frost Dragon
 
Right yours truly has been at it again.... no not that:p (ooh matron)

I am talking about using IC-DIAMOND with graphics card.

Case in point I was testing a ATI 6700 (ASUS) series graphics card and under (gpu fans set on auto) it was unusually high (whilst under 3dmark vantage) in temperature.

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So four quick screws later and to my shock i found this...........

Sorry for the bold line below folks, but it stresses on what I have been speaking of about TIM FAILURE during a high heat environment.

CLASSIC SIGN OF TIM FAILURE

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ON THE top right you can see where i have scraped off some of the TIM, which was bone dry and crumbled in my hands of which as you know should not happen. Also through out the GPU CORE we can see air bubbles. This is a classic sign of the paste's failure and spreading out (making voids or cracking) and thus spoiling temps.

So off we go and clean the blighter up:) I put a line down the middle and a couple of small blobs on either side.

DSCF71211024x768_zps0da34a4e.jpg


Temps before: on full load after one run 64c, after ICD 52C on full load.amb air temps as measured by my KELVIN probe ranged between 16.1 to 16.8c

Right I will edit this post with more results in a moment.

EDIT..

One old GTX 285 2GIG EVGA Model.

DSCF71071024x768_zps50267b46.jpg


Running with stock paste at 74C (full load amb temps at 16.6) gpu fan on auto.

One Kelvin probe i usually use during DICE OC sessions.

DSCF71061024x768_zpsc80617b7.jpg


Position of the probe in relation to the equipment.

DSCF71091024x768_zpsd7e83b4d.jpg


Let us pop off the HSFG shall we?

DSCF71101024x768_zps2998c35b.jpg


OOOOOOOOH dear here we go again, some classic signs of TIM failure here, but not as bad as the ATI model.

DSCF71111024x768_zps633d91f9.jpg


Note the only thing i changed was the TIM, and nothing else so the thermal pads were reused.

Now here is the method i use for LARGE gpu IHS, and this is also the EK 'approved' way too.



DSCF71121024x768_zps19d02167.jpg


Results from ICD from stock

68C (Down by 6c)
BRAND X 72c (Down by 2c)

THE correct and best method of application for 2011 PIN CPU's

note i did get a little carried away with the centre blob, however this method on larger IHS (CPU) is a great alternative way of insuring full coverage rather than just increasing the size of the blob in the centre.

DSCF71231024x768_zps9c430c46.jpg


I will copy all of this into the ICD air cooling section too:)
 
Last edited:
By the way, is it normal with GPUs to pack such massive amounts of TIM on the chip?
I was installing a waterblock on my 780 today and removed stock cooler ( evga 780 acx).
There was enough for 4 cpu's there, took me quite a while to clean it up.
 
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