Solder is not bad and certainly better than TIM but it’s not as good as thin layer of liquid metal.
Delidding is not for most users but it’s already proven for 12th gen to gain 10 degrees so far from pointless when you will gain another speed bin, ideally running with direct die WB once readily available for further gains.
I mean Intel are using solder, mad to delid it for liquid metal.
Delidding is not for most users but it’s already proven for 12th gen to gain 10 degrees so far from pointless when you will gain another speed bin, ideally running with direct die WB once readily available for further gains.