I would like the see the igp removed from the high end parts so they can move the cores further apart to aid cooling.
They already do on SB-E and IB-E, none of the socket 2011 CPUS have an IGP. They also use solder for the 2011 CPU heat-spreaders not TIM. Added to which, the HW-E chips are socket 2011-3 (Same number of pins as 2011 but incompatible). If they haven't increased the pin count, it's unlikely they have suddenly included an IGP.
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