Soldato
Thanks for the info.. i'll do a bit more testing this week.
In terms of the glue, i purchased the CPU from MM which was already delidded and glue applied.. but polishing the die did help the temps a bit by around 2 degrees.
This is mine with polish cores, just removed it yesterday and cleaned it up to fit the new TG Micro Direct Die Pro water block, the difference is night and day, its quite shocking how 1 revision has made such a difference, you can see in this pict that the glue stuff that AMD puts on covers pretty much all of the SMD's
With the new block:
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