I've got to agree. I suspect (read "hope"!) that all the cloud hysteria will turn out to be just that....or at least be mitigatable using X1 Plus firmware (may not help you with a P1) or developer mode.
wanted to be able to work with more than just PLA and an enclosure was going to be inevitable with ABS, PETG etc.
PETG you won't need an enclosure for...not that it hurts. You may need to open the glass lid for PLA though as annoyingly it
can hurt that with a nozzle clog. Only had it with PLA-CF to be fair.
Thing with ABS is that it was the thing to aspire to being able to print when I couldn't. One of the things that influenced my choice of the X1C in fact. Now I can print it, I bought a spool...and it's still unopened. I did have a go with ASA but to be honest, that was only because a relative wanted the colour and that was the only spool. The main reason? I've just not found the reason to outdo the negatives of it. ASA is 'easier', doesn't warp as much etc....but was still a pain and (for this particular use) no better that PETG that would have been cheaper and easier.
I've got a spool of ABS-GF as Clough42 (YouTube) found it dimensionally stable and less warp'y....but I've not yet found cause to use my precious special spool - you'll either get that of think I'm nuts.... either is fine
![Stick Out Tongue :p :p](/styles/default/xenforo/vbSmilies/Normal/tongue.gif)
Bambu's PETG-CF was good for strength and less of a pain than Eryone's (dribble and cardboard spool - not good for AMS). Still needed to be set slower for first top layer to make it stick rather than slide off the infill.
Bambu's PET-CF (no G for Glycol) was good for temperature tolerance....if you need that for a part.
Some of the PPS-CF sounds interesting but you'd need the requirement to justify the outlay.