An SOC doesn’t necessarily mean is has to have the ram on the same package. ‘M1’ is just marketing at the end of the day and Apple is free to package the chips as they see fit.
A series chips have the ram off package for example. It’s like that because of space constraints in something like a phone. Putting it on package makes that package too big.
As already stated, there are no ram chips that will fit on package that are bigger than 16gb. If they want to offer more than 16gb than is has to be off package.
They could offer sodim like the current iMac or they could solder it like the MacBook Pro. That’s their choice.
Personally I’d expect regular iMacs to come with soldered ram going forward. The lower end iMac small will likely just be an M1. It’s cheaper to produce and they can charge more to do it that way.
A series chips have the ram off package for example. It’s like that because of space constraints in something like a phone. Putting it on package makes that package too big.
As already stated, there are no ram chips that will fit on package that are bigger than 16gb. If they want to offer more than 16gb than is has to be off package.
They could offer sodim like the current iMac or they could solder it like the MacBook Pro. That’s their choice.
Personally I’d expect regular iMacs to come with soldered ram going forward. The lower end iMac small will likely just be an M1. It’s cheaper to produce and they can charge more to do it that way.
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