Decided this morning to tackle the Voodoo 3's cooling (or lack thereof) before pressing the K6-III machine into service. The original heatsink was passive, small, and clearly fitted haphazardly (as the pictures will show) as it didn't sit flat on the board.
I used my hot-air reflow station to warm the GPU and heatsink up, then carefully prised the heatsink from the chip using a Stanley blade. I have never come across a) so much thermal epoxy used on a heatsink, b) so little of the affected chip actually covered, and c) a harder compound, this stuff is like concrete!
Image 1: Yes, well done 3dfx, that's almost 2/3rds of the chip covered in compound.
Image 2: Sorry, how thick was this applied?
Image 3: Oh, right 2mm, excellent, just throw it on there!
Product of Mexico! Clearly something to be proud of and excellent quality control.
At the moment I'm soaking it in a glue remover, but I don't think it's going to touch it. Usually I'd simply sand the majority then polish the remnants so as to not ruin the print on the chip, but with so much to get rid of I can't start with sanding as it'll take days!
Any ideas for removal? I want to put a bigger, active heatsink on the card (I want to hit/break V3 3500 speeds) but I'm not going to put the new heatsink over that godawful compound, the thermal interface must have been so so poor.
FWIW: The heating process used to remove seemed to break the bond between the heatsink and the compound, but not touch the GPU/compound bond at all, I've tried using a Stanley blade whilst heating and it's making little to no difference compared with just using the blade alone.