Zen2 has "heat production" spread around pretty far from center of heatspreader:I don't think there is really a lot of difference between AMD and Intel dies / die placement under IHS
https://www.flickr.com/photos/130561288@N04/48258310682/
So good wide area contact plays lot bigger role than with monolithic CPUs.
Here's what Intel looks under the "lid":
https://hexus.net/tech/news/cpu/142900-overclocker-checks-intel-core-i9-10900k-delidding-benefits/