Would love to see the maths tbh. Unfortunately we can only guess at numbers.
Of course adding another memory bus takes up die space but individually they are a relatively small component of the total die area as you can see on this 3070 die shot:
https://images.hothardware.com/cont...5/content/small_GeForce-RTX-3070-die-shot.jpg
I’ve seen estimates of around $5,600 per wafer for Nvidia on Samsung 8nm so if we assume a full wafer of 3060 dies @ 392mm2 it’ll give 152 dies. Assuming around 90% yield that’s around $41 per die.
let’s be
massively overly generous and say it’d add 20% to the die area to accommodate them, it would then make it around $54 or about $13 more vs the $36 of 6gb more vram... of course you still need to add $12 of extra vram to get up to 8 so that then takes you to $25 extra to go with 8gb 256 vs $36 extra to stick with the 192 and up it to 12gb rather than 6.
Obviously all that’s based on a multitude of various assumptions and might be way off the mark but it’s as good a guess as any!
At worst I’d suggest there’s little in it and a wider bus with 8gb would likely outperform a narrower bus with 12gb at this card’s intended performance tier. Of course it isn’t as simple as just adding a wider bus with a mouse click, so not something you can easily just change on a whim - hence why I suspect they got caught out by AMD at an earlier point in the design stage and to make the best of the situation they find themselves in they’ve been pushed into making it 12gb when it was probably only ever intended to have 6.