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AMD to unveil Zen 4 CPUs at CES 2022

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Grim5 said:
Thisnis my concern, it's going to be difficult to apply thermal paste and 10 times more difficult to apply liquid metal and the chance of getting paste or metal on the side or under the IHS is high
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I'm not sure how people manage to get paste all over the place. Steady hand and take your time, don't apply too much too close to the edge. I've even seen some get it in the socket :confused:
 
I still concerned about heat, Those chiplets are nearly on the edge of the IHS.

My concerns is not too much of a problem for air cooling due - due to air block designs it doesn't matter where the heat source is as long as the block makes contact.


But with AIO it's a whole other story. AIO have two issues, firstly many AIO have round blocks and secondly AIO put their water channels right in the centre as you can see in the below examples.

What this means is that when you stick on AIO on Zen4, it's likely that only part of the chiplets will make contact with a section of the block that is cooled directly by the water channel. And this does matter, many tests have shown that AIO coolers provide the best cooling right in the centre of the block because that's the part that is directly cooled by water

This example below actually claims it's an extra big block with extra large water channel area, many AIO coolers are smaller


 
Grim5 said:
I still concerned about heat, Those chiplets are nearly on the edge of the IHS.

My concerns is not too much of a problem for air cooling due - due to air block designs it doesn't matter where the heat source is as long as the block makes contact.


But with AIO it's a whole other story. AIO have two issues, firstly many AIO have round blocks and secondly AIO put their water channels right in the centre as you can see in the below examples.

What this means is that when you stick on AIO on Zen4, it's likely that only part of the chiplets will make contact with a section of the block that is cooled directly by the water channel. And this does matter, many tests have shown that AIO coolers provide the best cooling right in the centre of the block because that's the part that is directly cooled by water

This example below actually claims it's an extra big block with extra large water channel area, many AIO coolers are smaller


Click to expand...

Its the same layout as Zen 3.

My cooler has an offset mounting option for exactly this reason, while its not exactly a gimmick it actually only makes about a 2% difference, which is why i haven't bothered, my motherboard comes with very chunky M.2 coolers that get in the way.
 
Grim5 said:
Thisnis my concern, it's going to be difficult to apply thermal paste and 10 times more difficult to apply liquid metal and the chance of getting paste or metal on the side or under the IHS is high
Click to expand...
Who the hell uses liquid metal on their CPU? I don't think extreme overclockers are going to care too much about the IHS design if they're doing suicide runs with their CPUs.

And frankly if you get TIM everywhere to the point it blobs under the IHS then you're an idiot who shouldn't be building computers.
 
Way too much anxiety about an IHS design IMO, if you're laying it on thick enough for it to run out of the sides to such and extent it would accumulate under the IHS then you're close to it spilling over in to the socket.
 
The increased thickness of the IHS should help dissipate the heat generated by the chiplets, negating the issues outlined above about small spot AIO coolers. Trade-off is increased thermal resistance passing through the IHS but AMD must have accounted for this.
 
IHS does look incredibly thick - this will likely be a learning experience for AMD as they've not had LGA type mainstream consumer CPU's for many years. It could have been done for longevity, reliability or other reaons we simply don't know.

Anyway, looking forward to see Zen4 performance, if it beats 13900k (Raptor Lake) in ST and MT I'll be buying one :)
 
Dave2150 said:
IHS does look incredibly thick - this will likely be a learning experience for AMD as they've not had LGA type mainstream consumer CPU's for many years. It could have been done for longevity, reliability or other reaons we simply don't know.

Anyway, looking forward to see Zen4 performance, if it beats 13900k (Raptor Lake) in ST and MT I'll be buying one :)
Click to expand...

Maybe if the 12000 series had a thicker IHS the CPU wouldn't bend under mounting pressure?
 
Grim5 said:
I still concerned about heat, Those chiplets are nearly on the edge of the IHS.

My concerns is not too much of a problem for air cooling due - due to air block designs it doesn't matter where the heat source is as long as the block makes contact.


But with AIO it's a whole other story. AIO have two issues, firstly many AIO have round blocks and secondly AIO put their water channels right in the centre as you can see in the below examples.

What this means is that when you stick on AIO on Zen4, it's likely that only part of the chiplets will make contact with a section of the block that is cooled directly by the water channel. And this does matter, many tests have shown that AIO coolers provide the best cooling right in the centre of the block because that's the part that is directly cooled by water

This example below actually claims it's an extra big block with extra large water channel area, many AIO coolers are smaller


Click to expand...

Also the I/O chiplet has an IGP in it too on top of the normal I/O.
 
V-cache Zen 4 and 5 confirmed, should be interesting, hopefully they learnt a few things with the 5800X3D and polish it further.

8-10% IPC increase so not as large as previous jumps but still a decent boost. Mix that with the higher clock speeds and it'll be fine.

4c and 5c confirmed, I guess these are the compact versions which will be mainly used in the server space. Potentially the efficiency cores for future CPUs if rumours are true.
 
Orcvader said:
V-cache Zen 4 and 5 confirmed, should be interesting, hopefully they learnt a few things with the 5800X3D and polish it further.

8-10% IPC increase so not as large as previous jumps but still a decent boost. Mix that with the higher clock speeds and it'll be fine.

4c and 5c confirmed, I guess these are the compact versions which will be mainly used in the server space. Potentially the efficiency cores for future CPUs if rumours are true.
Click to expand...

Zen 4C is Bergamo, 128 cores, 256 Threads

Zen 5 is even more cores, presumed 256 cores 512 threads
Zen 5C 384 cores, 768 threads.

Don't quote me on those last two. those nutty two.
 
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