Take my GPU as an example.
Its an MCM GPU so i'll explain what on the GPU die and what isn't.
In MSI OSD AMD report the total board power, that's the core, the MCM chips, the power stages, the Memory IC's, the fans.... everything , it has a TDP rating of 260 Watts, i've never seen it pull more than 250, usually around >240, stock.
GPU Core Power: 127 watts
GPU SoC power: 43 watts
GPU USR Power: i don't know what that is so i'll add it here: 14 watts
That's it, 184 watts total. that die is 200mm
The rest.
GPU Memory Power VDDIO: those are the IMC's: 30 watts
GPU Memory Power VDDCI_Mem: memory IC's: 12 watts
The rest to make up the 268 watt board power draw (its overclocked) will be board components not listed, which includes the fans.
So 184 watts for a 200mm die (This is overclocked) here the GPU is running at 63c, its a good cooler.
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The 14900K is 250mm, its pulling 287 Watts in Blender, 200 watts in Cyberpunk, holy ____!
Doesn't seem too bad for a 250mm die, however most of that power is concentrated in this area. An area less than half of the die. I don't know what that heat density is but its probably double what mine is, its why they are so difficult to cool.
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