R9 3900X (Batch Code: BF 1944SUT)
C7HWIFI UEFI 3004 AGESA Combo-AM4 1.0.0.4B
Crucial Ballistix Sport LT 2x16GB kit (BLS2K16G4D32AESB)
RX Vega 64
Intel 660P 1TB NVMe on M.2_1 of mobo
ASUS Hyper M.2 x16 Card with 2x Adata SX8200 Pro 1TB NVMe (PCI-E slot in bifurcation of 4x/4x)
2x SATA HDD 2TB
Bykski A-Ryzen-ThV2-X (AS5 TIM)
2x Magicool 360 G2 Slim rads (3x Arctic Cooling F12 PWM per rad, top as exhaust, front as intake)
EK XRES 140 Revo D5 PWM
Be Quiet Dark Base 900 with mesh mod to front, upper panel mesh airflow improved. 1x Be Quiet Silent Wings 3 140mm PWM 1000rpm used as rear exhaust.
No additional cooling to RAM, 3333MHz had done RAM Test of 200%, completed a bench of AIDA64 and when went to open Ryzen Master system froze. Upped VDIMM to 1.355V on rerun did not have same issue. Run upto 3600MHz was nice and easy, ~1hr into Kahru RAM Test saw 5 errors. 3666MHz even with some changes to slights changes to ProcODT/RTT/timings/voltages hasn't gained me further stability, all tests on that MEMCLK have so far had extremely high error count in <50% run of RAM Test. At times experienced BSOD.
All test data in
this ZIP, organise by time to see process better of testing so far.
So far my opinion is it's decent RAM in context of price.
I saw on the
Reddit thread people saying Micron E is easier on IMC, IMO hyperbole.
Samsung B die is more flexible, is more friendly IMO, same sorta testing I can be up at 3733MHz/3800MHz with ease. If you already have B die or it is costing not vastly more than Micron E it is the better buy still with Ryzen 3000 if you value ease of OC, etc, etc.
Past testing of current R9 3900X on 4x8GB 3800MHz RAM Test 22K% PASS in
this ZIP, same chip on
3733MHz using stock voltages for SOC/CLDO_VDDP/CLDO_VDDG/VDIMM, etc.
Will carry on with some more testing
.
*** edit ***
Just as background I spend more time tinkering with my rig as pastime then using it.
After seeing how I need to increase SOC from 1.025V to 1.043V to gain past
~1hr on RAM Test with Micron E@3600MHz there is no longer a doubt it is not easier on IMC vs Samsung B die.
The C7HWIFI uses daisy chain topology, should favor 1 dimm per channel (ie the Crucial kit of 2x16GB), but I have high stability runs of 4x8GB Samsung B die at even stock voltages@3800MHz, see these ZIPs
1,
2 &
3.