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So TLDR if Intel used solder (or just sorted out their TIM application) temps even on their high tier chips would be respectable?
I'd like to imagine someone in Intel is very embarrassed that people are delidding their premium grade chips and getting results like this, but I doubt it![]()
Sadly and frustratingly nobody really cares, just the way Intel likes it.
Minimal effort, maximum gain, thats Intel right now... they have the market share to move like that, even with AMD competing now, Intel can still put out shoddy junk and rake in the dosh, even with the security exploits etc, rubbish TIM, people will still gobble up their products.
@faceman123 did you get my trust pm about the invoice for the 1080 you sold me ?
Here's the video
Shocking when I popped off the IHS, just how crappy the TIM was
I realised something about this process - it's hard to know if you've fully sealed the contacts because the stuff is clear. Using coloured polish will give you visual indicationclear nail varnish but didn't video that bit
The argument is that with modern CPU the power states means the CPU can rapidly cycle between hot and cool which over the long run can lead to solder cracking hence why they have chosen to use thermal paste. I don't deny this enlargement but I've not come across it personally, I guess with all the Zen CPU's on the market it's a bigger potability so it's wait and see I guess.So TLDR if Intel used solder (or just sorted out their TIM application) temps even on their high tier chips would be respectable?
I'd like to imagine someone in Intel is very embarrassed that people are delidding their premium grade chips and getting results like this, but I doubt it![]()