The argument is that with modern CPU the power states means the CPU can rapidly cycle between hot and cool which over the long run can lead to solder cracking hence why they have chosen to use thermal paste. I don't deny this enlargement but I've not come across it personally, I guess with all the Zen CPU's on the market it's a bigger potability so it's wait and see I guess.
With the cooling around these days surely the temp changes are more gradual so its less of an issue? As in compared to a really fast hot then cold cycle.