You'd have to show something to back that up because that's not really true (at all, in fact). 1. Yes, the CPU will run hotter, however the TIM through thermal cycling won't degrade or crack nearly as quickly. In fact, it's only likely to do so if using sub zero cooling, which is why a much, much thicker compound is used for benching when delidding the CPU. If a soldered CPU suffers micro cracking along the length of the die, depending on the size of the fracture you may as well not have a heat spreader at all. 2. Yes, obviously using a compound is cheaper than sourcing gold and indium, both rare materials. However, this isn't the only reason no matter how many times it's speculated. It's a mixture of time, money, environmental footprint and longevity. 3. Using a different thermal compound doesn't change anything to do with overclocking settings. Scaling rules, VID and board partners aren't privy to the thermal compound used, that's just a silly thing to say. You just have to be aware of the bigger picture here. We understand the benefits here, but we're a small fraction of users, and ultimately there are real legitimate reasons for all of it. Just don't knock Intel about so much for it. If you really knew better, you'd be on an 8 figure salary.