And yet you aren't blaming Nvidia for insulating GPU with frame around die trapping good insulator known as air in there:Even if they generated no heat whatsoever (not going to happen) their physical presence packed around the GPU would still act as insolation making cooling more difficult.
https://images.anandtech.com/doci/11180/GeForce_GTX_1080Ti_PCB_1488491310.jpg
Except with big enough surface areas/airflow contact with air doesn't cool much... Being very typical gas as good heat insulator.
While thermal conductivity of silicon is better than that of iron/steel!
https://en.wikipedia.org/wiki/Silicon
https://www.engineeringtoolbox.com/thermal-conductivity-d_429.html
And the longer distance away memory is the more power signaling consumes per transferred bit/bandwidth.
That's why HBM/HMC where invented and anything made for minimal power consumption favours integrating more memory into SOC if possible or then having it short distance away.
https://www.extremetech.com/computi...es-between-wide-io-hbm-and-hybrid-memory-cube
https://www.extremetech.com/computi...m-is-a-major-roadblock-to-exascale-and-beyond
For same reasons Panasonic GH2 had DRAM memory chip package stacked on top of processor package.
https://www.eoshd.com/2011/02/panasonic-gh2-teardown-inside-the-gh2/