I guess a good alternative solution would be to use Liquid Metal for the core-to-IHS interface and your TIM of choice for heatsink-to-IHS.
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Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report
- Thread starter Twirlywoos
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What kind of blade exactly?
If it's too thin it will flex and could scratch the green silicon which would be very bad.
The last time I removed the IHS I crushed the core.
Don
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Jokester did you use arctic Silver 5 under the IHS? how did it compare results wise to liquid metal etc??
Don
I just used it naked with AS5, I found using the IHS was too much faff with it and just ended up with worse temperatures.
Ok this is the thread where OCUK say Liquid pro isnt for long term use it's post number 14,
http://forums.overclockers.co.uk/showthread.php?t=18063812
Cotti.
http://forums.overclockers.co.uk/showthread.php?t=18063812
Cotti.
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Its probably due to its bonding properties that it is suggested to not be for long term right?
If so then due to the likelyhood of removing the IHS being a one time thing, it is probably very good stuff to use and will see better results than AS5 etc
If so then due to the likelyhood of removing the IHS being a one time thing, it is probably very good stuff to use and will see better results than AS5 etc
No thermal paste is really meant for long term in all fairness... I doubt there are many people that seat a heatsink/cpu block on some TIM and run that TIM for 5 years with out ever changing it at some point. If you use too much AS5 for example you can end up sticking your heatsink to the CPU and it's near impossible to remove the heatsink with out ripping the CPU socket out as well.
Associate
Ouch lol
Well 5 years is a long time to be using any chip and I dont expect to not upgrade by then. I guess it will be the liquid pro or ultra on my next purchase list, after I get my Ivy and start checking out its temps and OC'ability. If it runs hot i will replace the TIM with Liquid pro.
Any benefit from using the ultra instead of the pro under the IHS btw? easier to use- less hazardous or just the same?
Not sure about the TIM's for under the IHS. My current build I plan to keep for at least 3-4yrs possibly 5 at a push. I'll be using a custom loop soon which means later on (especially if I do the TIM mod (not that I can figure out how I'd ever get the IHS off) I could OC my chips nuts off with in reason 
))
))Wonder if they'll change this for Haswell, or even a revision of Ivy Bridge itself? Seems unlikely, but one can live in hope.
I pity the poor guy who buys one of these and jumps straight into slicing off the IHS only to find Intel changed their manufacturing process back to fluxless solder and he pulls off the core
I pity the poor guy who buys one of these and jumps straight into slicing off the IHS only to find Intel changed their manufacturing process back to fluxless solder and he pulls off the core
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Wonder if they'll change this for Haswell, or even a revision of Ivy Bridge itself? Seems unlikely, but one can live in hope.
I pity the poor guy who buys one of these and jumps straight into slicing off the IHS only to find Intel changed their manufacturing process back to fluxless solder and he pulls off the core
Lol, I think an announcement or at least some coverage of it would be made. I honestly dont think they will change this manufacturing process for Ivy's, they are fine as hey are at stock and that is all Intel care about.
We have so little information about Haswell but for rumours, if AMD dont come up with something I can see Intel biding their time on it and possibly releasing it much later than anticipated, drawing their revenue from Sandy vs Ivy. Maybe even drawing it out further when PCI-E becomes used more. Ivy-E will be the next used, so I dont expect Haswell until late next year if honest, due to the lack of competition from AMD.
But that is for another topic. I will probably be delidding my I7 when I get my hands on it. First I shall test it out to see what temps are like around 4.5, if it hot it will get the chop
Soldato
why amateur
i thought i was pretty pro seeing as i didn't break anything(my finger with a small bit taken out of it may disagree though
)
Soldato
why amateur
(my finger with a small bit taken out of it may disagree though
It was taking me forever to write that post and to entertain myself I started making up alternative names for products.
Soldato
Wonder if they'll change this for Haswell, or even a revision of Ivy Bridge itself? Seems unlikely, but one can live in hope.
I pity the poor guy who buys one of these and jumps straight into slicing off the IHS only to find Intel changed their manufacturing process back to fluxless solder and he pulls off the core
It will be on the spec sheet as it was with Ivy.
Well I managed to delid my friend's 3770k in the end ... I baked it in the oven at 80C for 10 minutes to soften the silicon adhesive, then it it took me 2 minutes to take the top off
He was thrilled. Said it lowered his temps by ~15C. I replaced it with Liquid Ultra between CPU & IHS, and he used Liquid Pro as his TIM between IHS & cooler.
When he had it set up again, I was struck by how little heat it dissipates. Whilst I hate Intel with a passion, the summer's just too warm to keep Thuban around ... Bulldozer, Ivy & Sandy are so superior in the amount of juice they need to run at low loads. So I got a 3770k and a Gigabyte Sniper M3 (the mATX board). I'll probably go back to AMD if Piledriver is as much of an advancement as it seems like it'll be, but for now I'm pleased with a much lower power draw ....
I've been setting up today. Again, baked the 3770k, delidded, cleaned, replaced Intel's pig**** with Liquid Ultra, used Liquid Ultra as my IHS -> cooler TIM.
Temps are very good. Max of roughly 65C (lower most of the time) @ 4.4Ghz in Prime Blend.
P.S. I should say that my case is a small FT-03 with only 2 out of 3 case fans installed (Akasa Apaches), and a TR Venomous-X cooler (again with 2x Akasa Apaches in push-pull). So the temps with Liquid Ultra & Liquid Ultra are pretty decent ...
He was thrilled. Said it lowered his temps by ~15C. I replaced it with Liquid Ultra between CPU & IHS, and he used Liquid Pro as his TIM between IHS & cooler.
When he had it set up again, I was struck by how little heat it dissipates. Whilst I hate Intel with a passion, the summer's just too warm to keep Thuban around ... Bulldozer, Ivy & Sandy are so superior in the amount of juice they need to run at low loads. So I got a 3770k and a Gigabyte Sniper M3 (the mATX board). I'll probably go back to AMD if Piledriver is as much of an advancement as it seems like it'll be, but for now I'm pleased with a much lower power draw ....
I've been setting up today. Again, baked the 3770k, delidded, cleaned, replaced Intel's pig**** with Liquid Ultra, used Liquid Ultra as my IHS -> cooler TIM.
Temps are very good. Max of roughly 65C (lower most of the time) @ 4.4Ghz in Prime Blend.
P.S. I should say that my case is a small FT-03 with only 2 out of 3 case fans installed (Akasa Apaches), and a TR Venomous-X cooler (again with 2x Akasa Apaches in push-pull). So the temps with Liquid Ultra & Liquid Ultra are pretty decent ...
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Soldato
Why did i not think of an oven? I blowdried and cut the adhesive whilst on a vice 