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Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report

The HIS is nickel plated copper, read section 2.1.7 (Processor Materials)

Nothing on DIE cap to HIS materials
 
Martini1991 said:
From reading that it doesn't look like he's de lidded the IHS, rather change the paste from the IHS and die.
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Yes, that's what I got from the forum thread that was linked

"I changed the paste between the IHS and die, but the IHS HAS to be in place, or else the brittle processor pcb does not make proper contact with the socket pins."
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.. pretty pointless operation, except to show how difficult this is going to be.
 
if you would make it from lets say SILVER it would actually work better than direct contact of waterblock not by much tho....
 
PC enthusiasts with Ivy Bridge engineering samples, and reviewers at large have come to the consensus that Ivy Bridge is a slightly warmer chip than it should be. An investigation by Overclockers.com revealed a possible contributing factor to that. Upon carefully removing the integrated heatspreader (IHS) of an Ivy Bridge Core processor (that steel plate on top of the processor which makes contact with the cooler), the investigator found common thermal paste between the CPU die and the IHS, and along the sides of the die.PC enthusiasts with Ivy Bridge engineering samples, and reviewers at large have come to the consensus that Ivy Bridge is a slightly warmer chip than it should be. An investigation by Overclockers.com revealed a possible contributing factor to that. Upon carefully removing the integrated heatspreader (IHS) of an Ivy Bridge Core processor (that steel plate on top of the processor which makes contact with the cooler), the investigator found common thermal paste between the CPU die and the IHS, and along the sides of the die.
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Surely using steel has made things worse. Weren't IHS's made of nickel plated copper before?
 
Lord_ZED said:
if you would make it from lets say SILVER it would actually work better than direct contact of waterblock not by much tho....
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Not sure about that the difficulty is in getting heat transferred from the die to the IHS material, you need to use TIM to fill the microscopic gaps between surfaces so obviously the less layers and TIM needed to be used the better. With a IHS you have double the number of gaps needing to be filled with TIM.
 
What the guy maybe could have done is cut around the sides of the ihs to expose the core but leave the outside frame in contact with the substrate part of the cpu, that way he could have mounted the cpu into the socket and used the correct clamping force for the pins, then attach a heatsink to the bare core.
 
Yeah the IHS is purely there for mechanical protection of the core. Since the current socket design from Intel uses the clamp over the top of the IHS to keep the chip in place before you place the standard cooler on, removing it causes you a problem.

The solution is to use a cooler that can also be used to clamp the chip in place (pretty much any waterblock will do this).
 
high temps are due to the actual cpu architecture not the ihs,the use of trigate transisitors and because they are so tightly packed together
 
wazza300 said:
high temps are due to the actual cpu architecture not the ihs,the use of trigate transisitors and because they are so tightly packed together
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It won't make that much difference - as one of the articles points out, solder is 16 times as good at heat transfer as TIM - so if the delta T through the solder was 1C, then the TIM would be 16C hotter.
 
its been said in one of those links above removing the cpu's lid gained 50hz more speed thats all,it did 0 for temperatures
 
wazza300 said:
its been said in one of those links above removing the cpu's lid gained 50hz more speed thats all,it did 0 for temperatures
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He also said that he didn't clamp the CPU properly because the chip retention bracket doesn't fit properly without the IHS, so that it had to be in place regardless.
 
i dont know,id say its just a hot running chip due to the architecture,intel wouldn't go to all the trouble of adding a ihs if they could have a cooler running chip without it

perhaps it will be more refined process with haswell? and back to sb temperatures? idk

real world testing/results are already showing decent temps on the 3750k chip anyway
 
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