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Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report

The Tech Report was able to get a comment from Intel. It's not exactly conclusive, but does shed a little light.
http://kingpincooling.com/forum/showthread.php?t=1730&page=2

Curious, we asked Intel about the interface between the Ivy Bridge die and the heat spreader. Intel has confirmed to TR that Ivy uses a "different package thermal technology" than Sandy Bridge. The firm stopped short of answering our questions about why the change was made and how the thermal transfer properties of the two materials compare. However, Intel claims the combination of the new interface material and Ivy's higher thermal density is responsible for the higher temperatures users are observing with overclocked CPUs.

Intel also points out Ivy Bridge has a higher TjMAX specification, which governs when the CPU starts throttling in order to protect itself from heat damage. The cut-off for the Core i7-3770K is 105°C, while the 2600K starts throttling at 100°C.
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http://techreport.com/discussions.x/22859
 
So they're either corner/cost cutting or have it done it to allow enthusiasts to get maximum cooling performance by removing the IHS completely? that's what it looks like to me.
 
mmj_uk said:
So they're either corner/cost cutting or have it done it to allow enthusiasts to get maximum cooling performance by removing the IHS completely? that's what it looks like to me.
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I don't think they give a diddly about cooling for enthusiasts. I do however think they give a diddly about cooling for laptops, could have been done to give an option to laptop manufacturers to pull off the IHS and connect their custom heatpipe solutions directly. With IB being an amazing chip for laptops what with their power usage and IGP, that wouldn't surprise me.
 
Does the tjmax change infer that the new 3D transistor is less susceptible to heat damage? I'd think it unlikely that they would shave off any safety margin without good cause.
 
So bit confused here, has anyone removed the IHS and ran the chip bare with the heatsink holding it in? Does it actually work and run? Or will it be easily damaged ?

I'd do it if I knew removing the IHS would be >90% successful
 
Combat squirrel said:
So bit confused here, has anyone removed the IHS and ran the chip bare with the heatsink holding it in? Does it actually work and run? Or will it be easily damaged ?

I'd do it if I knew removing the IHS would be >90% successful
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We'd have to wait and find out. Though the A64s had quite a significant result as far as i can remember. You had to be brave though and end up having problems selling the chip later on.
 
Back in the old Athlon days OCUK sold some spacer bracket things that you put on top of the chip and sat around the core, it allowed the heatsink to be attached squarely without you being able to put too much pressure on the die.

But has anyone tested temperature without the IHS yet? there's probably not much point in doing it if the temp only drops 5C.
 
Jokester said:
If it's like the old A64s, it'll be easy to take off, my only worry would be how brittle the chip is.
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Very risky. Even one turn of the screw or tilting slightly onto one corner could crack the core. I crushed my A64 3 days after the initial setup.

I suppose if you were dishonest like a lot of people here you could just put the IHS back on and RMA it. :p
 
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