Of course they're going to have 7nm products, just after AMD. Due to their release cycle, and due to TSMC being later.
TSMC's first 7nm process is only for low-power chips, so their good yields and being ~3 months ahead of GloFo is only for mobile processors. Also it uses a very different track height, so is a different density and unlikely Nvidia will even use that process for a pipe-cleaner like the 750 Ti.
TSMC's high-performance 7nm will be available possibly as much as 6 months after GloFo's, since GloFo is going high-performance first.
Nope the site that is putting out that info is wrong - see the cadence link in the anandtech thread I linked above.
Both GF and TSMC are about on the same schedule for high performance variants - might be a month or two in it but both are running off test silicon for major clients and projecting volume production on about the same timeframe.
EDIT: Quoting some relevant sections to posts recently on this subject - this is straight from TSMC:
12FFC is an optical shrink from 16FFC, but some of the logic density and power reduction comes from the low-track standard-cell libraries, so it is best not to just shrink at the die level. Instead, logic should be re-implemented with the new libraries, but SRAM, analog, and I/O just require recharacterization. Comparing N12 to N16 there is a 20% area reduction with the 6-track library, or a 14% area reduction with the 6-track turbo library. There is also a higher performance 9-track library that obviously gives up more area. For HPC, there is a variant process with overdrive and larger contacted-poly-pitch (CPP). In the interconnect, there is wider metal, large vias and via pillars, where you can put vias on top of each other, and so get from low metal to high low-resistance metal without requiring much area and not requiring the risk of EM issues on intermediate layers. TSMC will be ready next month for N7 HPC. At N7+ HPC should get about another 4% improvement in performance or 15% in power versus N7.
- N10 is in volume production with all technical and customer product qualification complete and volume production in F12 and F15
- N7 is targeted at mobile, HPC and automotive and will be "TSMC's finest technology, serving all segments." For power sensitive applications it will be even better than 16FFC but there as the optimized performance version for applications that demand the most performance, and it also fulfills automotive needs. Risk production is April 2017. More than 20 tapeouts are planned this year.
- N7+ will be ready in 2Q 2018.
Someone is deliberately putting out FUD about TSMC/nVidia recently that I've seen a couple of other people repeating here and AFAIK its all BS.
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