OCUK Official IC Diamond/ Perihelion Test Results

Intel E2160 on J&W Ip35-Pro, Air cooled with Arctic Freezer 7 Pro.
Frequency 1804.01Mhz
Voltage 1.325v

Before Compound: Arctic Silver 5
Ambient Temp: 16 degrees
Idle Temp: 18 degrees
Load Temp: 38 Degrees

IC Perihelion
Ambient Temp: 16 Degrees
Idle Temp: 18 Degrees
Load Temp: 36 Degrees

Overall I am quite happy with the results, I didn't expect that the idle temps would be all that different given the overall ambient temperature being so low at the moment, however I was happy to see a drop in the load temps which is always good to see.. Certainly the recommended application method, is more in line with what people would expect, rather than the more 'fiddly' methods that we have been using for a number of years.

Overall, quite happy with the results :)

Thankyou Innovation Cooling & OCUK
 
Just put ceramic on my 2 GTX 470 MSI Twin Frozr, and they sure seem to like Graphics cards, will post results when its cured a bit but initially looks amazing, circa 20 degree drop!
 
OK so I have ran some before tests, but I haven't had time to perform any after tests.

I have SS and will post as soon as I have done the after, which will be on Tuesday.

Nick
 
OK I cannot do a B4 and after based on brand as I dont know what MSI ship on the twin frozrs...

All I can say is GTX 470 with fan locked @ 68% Volts @ 1.000mv Clock of 750 Core

Temps were 70 - 73 depending on ambient......

Case door shut


With Perihelion the ceramic stuff applied...

Ive dropeed fan speed to 62% so I cannot hear it now...

Temp with case door on is 59 degrees, with side off its 52...

So massive drops.. Case is 800D....

Not so impressed on CPU - wont bother posting... But will do a head to head of MX3 vs IC 24 later this week with more detail - both under H70's cooling OC'd hex cores...

Agree with the poster above though.. The ceramic is a bit thick / dry and is difficult to work with.....
 
before applying when using a new tube of ic24,remove a small amount on to a tissue as it is a little dry where the air has made contact with the paste.then apply a pea sized amount to the cpu and firmly press down the cooler.
 
Anyone knows how this compares with indigo extreme ? Got a pad left but not too keen on installing it as it means taking apart and isolatng from a single loop specially if IC diamond works better. Im assuming the diamond is more conductive than the liquid metal pad ?
 
Hey,

My results using the old spread it out yourself method ( I'm not comfortable trusting a blob to spread itself when you can't see it :( )

Before

I5 760 @ 4ghz with arctic cooling freezer 7 pro


AS5 IDLE-----------IC Diamond Idle
31-----------------31
27-----------------27
29-----------------29
24-----------------24

AS5 LOAD----------IC Diamond Load
69-----------------66
69-----------------66
63-----------------61
67-----------------65


I'd like to thank ocuk for the sample, but as far as I'm concerned those numbers are not worth the 3x price hike from AS5. Maybe my application method has royally messed up my figures, if you all think it has I'll reapply it with the blob method and have another go?

Thanks
 
Hey,

Further update, just tried it with the 5mm blob method and temperatures have increased two degrees across all cores. Not impressed! :mad:

Edit : Further update again!!

Just reapplied using the old spread it out yourself method, and with a 2 degree increase in ambient room temperature I have the following results now -

66
66
61
65

So I'm reasonably happy with it now, however my previous verdict still stands. Its not worth £10 extra over AS5. I'd be intrigued to try some of the MX3 as people seem to get great results with that so I may purchase some when my new psu turns up! :)
 
Last edited:
Azuse05 said:
Sadly no paste will come close to any lma.
Click to expand...


In order to qualify you have to quantify - What are the theoretical limits of thermal compound performance?

There has been some serious lab work done in the last 20 years by some really good engineers, but you do run into practical limits.

Notes On The Limits Of Thermal Grease Performance

The best possible performance for any thermal grease would be 100% heat transfer from the CPU to the heatsink – which is impossible. We have measured thermal performance for the best possible case – directly soldering the CPU to the heatsink. In this extreme case using a solder joint, the difference between the CPU and the heatsink was 0.5 degrees C.

Based on test results from 391 users among 11 PC Forums, IC Diamond Thermal Compound showed 0.8 – 0.9 C difference between the CPU and heatsink – a difference of only 0.4 C compared to the solder joint.

User results showed other thermal compounds ranging from 1.1 C to 4.7 C difference less performance than IC Diamond, as shown on the performance graph, a difference due to the ingredients in the thermal compound used. Twenty years of thermal compound development have reduced the difference between using a solder joint to about 0.4 C. Further development may reduce this difference by a few tenths of a degree, but for all practical purposes you are at theoretical limits.

Sept30condensedmultiforum.PNG
 
I think my spreading skills have improved a lot, on this application over my AS5 my temps dropped a lot at idle. I must have made a right pigs ear of it before.

i7 920@4Ghz on Air cooling
Before (With AS5): http://i51.tinypic.com/j7qcd5.jpg
After (With IC Diamond): http://i53.tinypic.com/b7yhzo.jpg

Prime95 burn test:
After (With IC Diamond): 66

I forgot to record my before temps for burn test, because I'm a dumb ass. Forgive me.


I'm satisfied with the product, it is better than AS5, how much comes down to me not applying it properly before I don't know, but still impressive drops even at idle on my temps, I can assume that fully load the temps would have dropped even more. I think possibly from around the 71-72 mark it would have been, but obviously due to me being a muppet I can't give it a 100% statement.
Thanks for the awesome stuff, going to put some of this on my GPU after Christmas :)
 
tommytinkle said:
Hey,

My results using the old spread it out yourself method ( I'm not comfortable trusting a blob to spread itself when you can't see it :( )

Before

I5 760 @ 4ghz with arctic cooling freezer 7 pro


AS5 IDLE-----------IC Diamond Idle
31-----------------31
27-----------------27
29-----------------29
24-----------------24

AS5 LOAD----------IC Diamond Load
69-----------------66
69-----------------66
63-----------------61
67-----------------65


I'd like to thank ocuk for the sample, but as far as I'm concerned those numbers are not worth the 3x price hike from AS5.
Thanks
Click to expand...

tommytinkle, thanks for taking the time to test and post comments/results. Much appreciated

Thermal compound should be specified in volume vs weight as it leads to confusion in comparisons.

For example ICD7 Diamond weight is 1.5 gm or 7 carats - by volume approx 1/2 ml.

AS5 Silver weight is 3.5 gm - by volume approx. approx 1/2 ml.


Same volume same price - 6.99

You had the ICD24 for test which is approx 4x the AS5 amount.

Application amounts are different as AS5 is more liquid than ICD . you should be able to get 3-4 applications on a 30mm IHS with the ICD7 and 12 out of the 4.8 ICD24.

I do not know about about AS5 but as a general rule the more liquid compounds tend to bake or pump out and some have to be replaced every few months and for this reason a common OEM specification is a requirement/recommendation for a bulk loading of 90%+. The simple reason for this is that it is just harder to pump or bake out a more solid material than a more liquid retail type compound.

At xtremesystems I have a guy(123bob) with a 20 system farm folding @home who has run 2 years 24/7 overclocked with no change in temps or having to readjust his clock setting's for the period.

The unexpressed value here is the cost/time savings of not having to renew the mount every few months.

I always get a mix of customers as noted in the previous comments there are the performance people who are always pushing envelope on their systems and those that want best Value/Performance for the money.

Perihelion was introduced for the Value/Performance segment, performance wise @ 120W I only measure 1C difference between Perihelion and ICD and users in the first test groups have been getting an average of a couple of C over AS5.

Perihelion with aluminum oxide is 20% lighter than ICD so you get the same volume in a 4 gm tube of perihelion as you would in a 4.8 gm tube of ICD.

So from your comments you seem to be a value/performance end user, with Perihelion you get 4X the amount as AS5 for the same cost and may be worth consideration.

And to note the viscosity of the Perihelion is mostly the same as ICD for the same long term reliability issues as discussed.

Application

Maybe my application method has royally messed up my figures, if you all think it has I'll reapply it with the blob method and have another go?
Click to expand...

Application can affect results from 1-20C but most are grouped in a range of 1-3 C. for optimal performance use our method. but other factors are more likely if you follow directions application is one thing that few screw up on but there are other factors that come into play.

Troubleshooting
 
Technical/Troubleshooting Note:

As most experienced users understand that when troubleshooting thermal problems there are usually 3 areas of concern.

1.) Pressure
2.) Contact
3.) Application

Taking a thermal measurement on it's own is not enough without a relative basis of comparison. Application and use of thermal compound is a mechanical function though many electronically oriented people tend to attach little importance to mechanical measurements.

Every thermal compound has it's own unique ideal pressure/thermal performance curve. A highly liquid retail compound with great contact resistance will test well at low or moderate pressures as they hit their Bond line thickness (BLT) or average thickness relatively easily but since they are at optimum at these lower pressures adding more pressure fails to yield much of an improvement.

IC Diamond is of a much higher viscosity and has a very different pressure/ performance curve than a more liquid retail compound so at lower pressures and/or contact thermal results maybe equal or less. In paste reviews the major failure is in quantifying the mechanical aspects of what is being tested, are they @ 35lbs and 50% contact area? or 60lbs 60% contact? And how does that relate to multiple thermal/performance pressure curves of different compounds?

Note: 80% of sampled retail sinks were over 50lbs psi

Quantifying mechanical's is not realistic for the individual user but they get around that by observing multiple user results to mentally average a comparison unlike the individual anecdotal test they have a reference point(s) more or less like we are doing here providing samples for comparison.

We generated the attached charts Below from some forum user tests.

What they show is what most know already - that good C/P provides a good thermal result. What it also shows is that IC Diamond performance margins increase with over 50 psi force and with good contact margins are higher. Pressure is dominant and contact will increase with pressure.



Data point # 2 has weak pressure and poor contact resulting in a + 3.7C increase in temps over the liquid paste.

Data point # 10 with great contact and pressure shows a -5C improvement over the more liquid compound.

This is a nontrivial approx 9C spread and pretty well explains why people get different results.

Also observe Point # 6 it has a somewhat lower pressure but a higher contact hence the improved thermal

So to optimize your thermal result, apply enough compound, tighten your sink and do some lapping

CombinedchartCPvsthermalperformance.png


CombinedchartCPvsthermalperformance-2.png
Click to expand...
 
Does anyone know the best way of applying thermal paste to an exposed heat pipe cooler such as the titan fenrir?

Im guessing spreading it out with a credit card would maybe be the way to go? Otherwise a lot of paste will end up in the gaps between the heatpipes if just the pressure of the heatsink were used to spread.
 
Hey,

A wee update -

Today according to the front panel of my silverstone case with one probe dangling in the air - ambient temperature is 17 degrees c.

CPU under prime 95 is giving me the following temps

63
62
59
61

Thats current - after getting to run 10 on prime 95. Again, 4ghz, 1.31875 volts and an arctic cooling freezer 7 pro in push pull config! Not bad for a £15 heatsink fan! :)
 
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