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Possible Radeon 390X / 390 and 380X Spec / Benchmark (do not hotlink images!!!!!!)

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Boomstick777 said:
Yeah it definitely looks that way, like how HD 8000 series (OEM) came out a lil before the R9 2XX series. 3XX for OEM and 4XX for consumer retail desktop GPU seems likely.

Def exciting times next year, with die shrinks and new architecture, the GPU space will get a fresh start from top to bottom and finally see some nice progression over the following years. With HBM 2, rumoured to be capable of 1TB of bandwidth, imagine what comes later on :eek:
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Yep :D really looking forward to this new line up. Who knows might be running a full AMD system next year. The Zen chip sounds promising.
 
Be nice to see amd come put with some good cpu's, intels last few have been pretty meh in terms of performance increases. The only question is if they do will they get a fair shot at selling them after intels dirty tricks with oem's in the past.
 
I wouldn't expect HBM in anything mainstream for a good while yet. Tier 1 and 1.5 maybe (390x, 390 or whatever).

It used to be the case that the likes of AMD, Nvidia and Intel never got involved in paying for working memory, that fell to AIB manufacturers. Now bad HBM stacks will come off their bottom line as well as bad dies. Should a manufacturing process be the cause of the fault, it's possible that both the memory and die are irretrievable
 
IIRC the memory and logic dies are fabbed seperately, even on different nodes.

The interposer I think is baked without any chips attached, then they are soldered to the pre-arranged points on top.

So GPU and mem are independently salvagable.
 
Orangey said:
IIRC the memory and logic dies are fabbed seperately, even on different nodes.

The interposer I think is baked without any chips attached, then they are soldered to the pre-arranged points on top.

So GPU and mem are independently salvagable.
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Maybe, as I understand it the more parts you add to the interposer the harder it is to get a full working unit? so they could have a lot of cut down version/s but I could be wrong as I haven't looked at any slides lately.
 
Orangey said:
IIRC the memory and logic dies are fabbed seperately, even on different nodes.

The interposer I think is baked without any chips attached, then they are soldered to the pre-arranged points on top.

So GPU and mem are independently salvagable.
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I don't think that is correct, the package is baked together rather than soldered together afterwards. I was under the impression that with Stacked HBM the connections ran through the middle of the stack, that is going to make soldering them onto the interposer rather difficult, with the substrate already in place. Unless they build the entire assembly from the top down.
 
bru said:
I don't think that is correct, the package is baked together rather than soldered together afterwards. I was under the impression that with Stacked HBM the connections ran through the middle of the stack, that is going to make soldering them onto the interposer rather difficult, with the substrate already in place. Unless they build the entire assembly from the top down.
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That is what I thought as well.
 
TaKeN said:
Water Cooled :( Please say it isn't so!
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Why not?

I think it would be great if the was a choice of selection. Maybe AMD ref design is water cooled then you have aftermarket make up there own choice..

Personally I think water cooled GPUs is the way to go.. Less heat, Less noise, more performance.

Whats to hate about that?
 
shankly1985 said:
Why not?

I think it would be great if the was a choice of selection. Maybe AMD ref design is water cooled then you have aftermarket make up there own choice..

Personally I think water cooled GPUs is the way to go.. Less heat, Less noise, more performance.

Whats to hate about that?
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I already have one radiator in my case, I don't really want another.
 
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