• Competitor rules

    Please remember that any mention of competitors, hinting at competitors or offering to provide details of competitors will result in an account suspension. The full rules can be found under the 'Terms and Rules' link in the bottom right corner of your screen. Just don't mention competitors in any way, shape or form and you'll be OK.

Possible Radeon 390X / 390 and 380X Spec / Benchmark (do not hotlink images!!!!!!)

Status
Not open for further replies.
Be a bit weird yanking a behemoth 295x2 out of a system to replace it with 2 little dinky 390's if they truly are half the size. :eek:
 
Last edited:
Gerard said:
Hopefully not a paper launch either.
Click to expand...

Yeah, but this was an investor's event, I dont think they could get away with that wording, coming means exactly that, AMD have got into trouble before for misleading investors.
Unless they are complete idiots they wouldn't use that wording for paper launches. IE its actually ready and waiting, probably for GDC in 3 weeks.
 
Why do you keep forgetting GDC was months ago? :p

Computex or E3?

Also, coming this quarter, there you have it **Removed**, hotchips in August is just another post-launch tech talk, as us
smart people already knew.

**No need for insults**
 
Last edited:
Still waiting for this, aio is not the best sign either. Do we not all want an epic single air cooled card that water brings out the best than a cheap aio hiding an otherwise hot card?
 
JeffyB said:
Still waiting for this, aio is not the best sign either. Do we not all want an epic single air cooled card that water brings out the best than a cheap aio hiding an otherwise hot card?
Click to expand...

tends to be a better ratio with watercooled with both noise and overall efficiency so in my case no.
 
Whilst I didn't mind the AIO on the x295. Having one come on a single GPU makes wanting Xfire a bit of an issue in many cases requiring placement on the 2nd cards AIO.

With having such a small card itself air cooling it would be more difficult unless it truely produced very little heat by consuming little power. There isn't much room to stick decent air cooling on that if power draw is similar to todays cards unless HBM runs cool.

Unless this runs 4k on one GPU having Xfire is an issue with 2 AIO's unless you go full loop. MUst be some air cooled AIB versions coming. Even if one does run 4k it will only manage current games unless DX12 gives massive boosts.

I'm waiting for these or the 980Ti's - coming out close together if Nvidia want to spoil the show................ is a consumers dream.
 
If the 390x is so short, etleast a 395x2 won't be super massive long, that's a good sign :)

Also, I wonder if they could make a tri gpu card :eek:

The Aio solution gets a thumbs up from me every time I hate fans and can't afford a full water loop and iv got space for pleanty of radiators in my case :)
 
IceShock said:
If the 390x is so short, etleast a 395x2 won't be super massive long, that's a good sign :)

Also, I wonder if they could make a tri gpu card :eek:

The Aio solution gets a thumbs up from me every time I hate fans and can't afford a full water loop and iv got space for pleanty of radiators in my case :)
Click to expand...

The real question is with a dual gpu if they'd still have two packages and a chip to connect them or if they found a way to stick them on one package and save a stupendous amount of space.

For all we know the 390x is aircooled and that half sized card that we presume is the 390 WCE edition IS a dual card and only that size. I doubt it is, but if AMD can get two gpu's on one interposer then we could have a stupidly small yet powerful card. Realistically for effectively HBM and interposers first time out in the real world I would expect relatively simple designs. What cpu/gpu/apu makers do with interposers 2-3 years from now will be very interesting though. Like making a cpu on one process, gpu/memory controller on another and sticking them together to make a super optimised APU.

I said a long time ago and have kept pointing it out, HBM will mean TINY cards in comparison to gddr5. Look at the images of Pascal, Nvidia were desperate to show mock ups of small pcb's with HBM before AMD released something so they didn't look 1+ year behind in technology. But the concept is the same, hbm takes up a tiny fraction of the space gddr5 does. Look at any picture of a bare pcb of a high end card 8-16 chips, that entire pcb space disappears, 1GB of hbm is something like 1/8th the size of ONE gddr5 chip, which is usually 256MB a chip or more recently 512MB. 8GB HBM should take up less space than 2 gddr5 chips, maybe closer to one.

A pcb simplified with all the memory off it, gives you incredibly simple routing of traces, a tiny portion of the traces required, probably something like 1/10th of what there currently is. It means one set of power components all lined up perfectly. No odd coolers that have to fit around and over capacitors awkwardly. Just the package to cool and the vrms.

On package memory will lead to most cards being very similar in size and way smaller than they are now.


You could probably fit a triple gpu card into at least some cases, but it's still just not practical.
 
Last edited:
"AMD's upcoming Radeon R9 390X graphics cards will ship in two SKUs - an air-cooled one, with a moderately long reference design board (though not as long as the R9 290X), and a new Water-Cooled Edition (WCE) SKU, which will feature a very compact PCB - one that could be no bigger than that of the GeForce GTX 970 reference. This is possible because of AMD's HBM implementation. The 8 GB of memory on this card is present on the GPU package, as bare 3D-stacked DRAM dies, surrounding the GPU die, with an IHS covering everything; rather than the GPU package being surrounded by memory chips. Other specs on hand so far, include 4,096 GCN 1.2 stream processors, 256 TMUs, 128 ROPs, and a 4096-bit wide HBM interface, which at 1.25 GHz memory clock, will offer memory bandwidth of 640 GB/s.

While Fiji package will be bigger than that of, say, "Hawaii," overall the setup is more space-efficient, and conserves PCB real-estate. The PCB hence only has the GPU package and the VRM. AMD is doing away with the DVI connector on its reference PCB. It will only feature three DisplayPort 1.2a and one HDMI 2.0a. The WCE variant will feature a pump+block covering the GPU package, which will come factory-fitted to a 120 x 120 mm radiator. The air-cooled R9 390X will be longer, but only to house a heatsink and lateral blower. The single-GPU card could offer performance comparable to the dual-GPU R9 295X2, which is faster than the GeForce GTX TITAN-X. AMD CEO Lisa Su, speaking at the Investor Day event, in New York, on 6th May, hinted that the product could launch on the sidelines of Computex 2015 (early June)."

http://www.techpowerup.com/212332/a...s-gtx-970-reference-r9-295x2-performance.html

Not so long for those that are waiting.
 
yes that makes sense

because it wont be a small card if it is air cooled !!! because it'll need to be at least two fans long with about 260W of cooling power, so maybe the size of the GTX 970

the cooler needs a large Mass to work properly, It can only be small if it's Water cooled
 
Last edited:
``The single-GPU card could offer performance comparable to the dual-GPU R9 295X2,``

.......so in theory you'll be buying a quieter Titan X :D
 
Mal X said:
yes that makes sense

because it wont be a small card if it is air cooled !!! because it'll need to be at least two fans long with about 260W of cooling power, so maybe the size of the GTX 970

the cooler needs a large Mass to work properly, It can only be small if it's Water cooled
Click to expand...

The pcb/actually board will still be small, the heatsink will be what the heatsink is. Though, think of it like this if the 290x card stopped half way down it's length, the heatsink could then become significantly wider at that point. Also a more simple surface layout on the pcb also leads to a heatsink that can be closer to the pcb across most of the surface. Effectively within a dual slot size, you can fit a hell of a lot more heatsink into that space across any length of card when you make the pcb a simpler layout and shorter in length.

We've seen it before in a different, way, a long while back and I think mostly for enterprise/professional versions you'd get the fan attached beyond the normal length of the pcb. The desktop version iirc had a heatsink/fan as usual, the professional version had more heatsink and a blower fan attached beyond the end of the pcb. Allowing for a thicker and more meaty fan and more heatsink area to dissipate heat from.
 
The single-GPU card could offer performance comparable to the dual-GPU R9 295X2, which is faster than the GeForce GTX TITAN-X. AMD CEO Lisa Su, speaking at the Investor Day event, in New York, on 6th May, hinted that the product could launch on the sidelines of Computex 2015 (early June)."

THIS IS WHAT WE ARE WAITING FOR!
 
Status
Not open for further replies.
Back
Top Bottom