Right now, not really.
- We know the review and early shipped units of the Trio has a 5-1 arrangement of the larger capcitors to 10 smaller capacitors.
- We know EVGA said they found that for their FTW3 card they needed a 4-2 arrangement, but that their XC3 was fine with 5-1.
- We don't know if the current Trios are shipping the same as the initial ones, or if MSI picked up on the issue and changed at some point (which might explain the nearly 0 numbers of them that seem to be out in the wild).
- We don't know what exact difference between the XC3 and FTW3 means one was fine and the other needed more, and how that translates to the Trio.
- We don't know that the capacitors are the only issue, since some people are reporting to have similar problems with suposidly "good" layout ASUS Cards and FE Cards
Its a developing issue, and while it seems fairly certain that the capacitors are part of what is causing it, it might be more than that.
Personally I suspect it'll turn out to either be
the 30% "ok" Bin 0 chips or the 10% "really good" Bin 2 chips that are susceptible this issue (either because they can't stay stable at higher boosts, or can boost higher and draw more current which the power delivery can't handle). EVGA just said they found the problem in testing, not that it affected all the cards, and from what we've heard AIB's didn't have time to actually Bin the chips themselves before starting manufacturing.