Associate
- Joined
- 7 Dec 2010
- Posts
- 223
98 tests were run by participants I may have missed one on reviewing 516 posts but there do not appear to be a load of complaints (if any) as you suggest.
Upon reviewing those tests you were in the outlier category which in a treatment of the data you would remove 10% best and worst performing data points from either end of the spectrum.
What was notable about the exercise was that a cluster of the low end outliers were (marked in red) were water blocks against an average improvement of 3.43C in this exercise
This low performing cluster was of interest to us so we had FrostDragon perform an investigation/analysis of the pressure and contact relating to WB with the following conclusion below.
In any case we are close to 1,000 public end user tests at this point and have spent time analyzing user results of when it works and when it doesn’t.
In the final analysis you end up with what experienced overclockers already know and is the first and most recommended solution on the forums and that is of course
- Amount of compound
- Pressure
- Contact
As a general rule 85% get a positive result with IC Diamond out of the gate, the remaining few percent from sample Contact and Pressure tests from endusers indicate you need approximately 60% contact and 45-60 psi for more optimal results otherwise you get get a heat dam effect.
Contact And Force Charts - In the two charts below from selected test data from endusers you will note that when contact area increases temperatures drop and when force increases temperatures also drop, the two parameters are inextricably linked to performance.
Compound is a simple mechanical process a little contact and a little pressure solves most problems.
Higher heat densities will provide higher deltas on temps as noted with the Notebook and GPU vs CPU
From most recent OCUK giveaway
good to know as the standard paste they put in it is quite worrying, as you will soon find out.
