To demonstrate what I mean these are the application notes from some popular pastes:
Arctic said:The ARCTIC MX-6 is a carbon filler-based thermal paste and reaches its maximum performance without burn-in, directly after application and distribution. It achieves all of this without any reputed ingredients, such as expensive diamond dust or various precious metal particles. The silicone gel used as a carrier enables optimal distribution, which is achieved through even contact pressure, for example when mounting the heat sink.
Even though we recommend to spread the thermal paste evenly across the whole surface you can alternatively also draw a thin X across your chip. The mounting pressure will spread the thermal paste between the two surfaces. However, make sure not to use too much paste.
Do NOT spread the line of thermal compound out.
When you place the heatsink on the top of the metal cap, the line of thermal compound will spread out like the pink oval pattern on top of the metal cap shown in photo QP4. Allowing the mounted heatsink to spread the thermal compound insures proper coverage, minimizes air bubbles and allows an optimum bond line between the two surfaces.