Yep, the recent OcUK newsletter featured an i7-6800K for £335.See the E-tailers/Retailers have taken a big axe to Broadwell-E chip pricing, some places have chips priced less than 7700K's etc. I can smell a lot of cheap X99 board incoming too.![]()
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Yep, the recent OcUK newsletter featured an i7-6800K for £335.See the E-tailers/Retailers have taken a big axe to Broadwell-E chip pricing, some places have chips priced less than 7700K's etc. I can smell a lot of cheap X99 board incoming too.![]()
Interesting article on the whole solder vs TIM thing:
http://overclocking.guide/the-truth-about-cpu-soldering/
Saying thermal paste doesn't perform as well as solder is a bit of an understatement given the difference can be 20-30 degrees! I am not convinced by the primary pro-thermal-paste argument either: how many CPUs over the years have actually failed due to solder cracks under the IHS? Four?Stop hating on Intel. Intel has some of the best engineers in the world when it comes to metallurgy. They know exactly what they are doing and the reason for conventional thermal paste in recent desktop CPUs is not as simple as it seems.
Micro cracks in solder preforms can damage the CPU permanently after a certain amount of thermal cycles and time. Conventional thermal paste doesn’t perform as good as the solder preform but it should have a longer durability – especially for small size DIE CPUs.
I think his point was more that soldering isn't actually that easy to do. Yes, it sucks that people feel forced to de-lid to achieve better temps. Most people overclocking these will most likely see pretty good performance with just the stock TIM.
And whilst people feel "cheated" by Intel, the product will still work, and run within thermal limits. It's not like Intel is deliberately trying to gimp their devices.
Side note: And honestly, all the blind lovey for one or the other company and then bashing whatever has become irritating to put it mildly. It's infantile and a waste of my time.
Oh the product will work fine, no qualms about that. It's interesting though that the primary edge Intel currently has is clock speeds and overclock headroom but if you're in a situation where you pretty much have to delid your very expensive CPU to be able to do that, it just further increases the price gap between an equivalent AMD CPU.Well said! I am disappointed with this myself, and will need to see the consequences of their decision, however the product will work fine. I won't be delidding for one.
Side note: And honestly, all the blind lovey for one or the other company and then bashing whatever has become irritating to put it mildly. It's infantile and a waste of my time.
Would you consider that over r5 1600xYep, the recent OcUK newsletter featured an i7-6800K for £335.
From my understanding solder cracks only appear due to the extreme temperature changes. Surely you won't get this during home use of a Chip.Saying thermal paste doesn't perform as well as solder is a bit of an understatement given the difference can be 20-30 degrees! I am not convinced by the primary pro-thermal-paste argument either: how many CPUs over the years have actually failed due to solder cracks under the IHS? Four?
People also wouldn't care as much if Intel used good quality thermal paste and applied it well. We're talking about £300+ CPUs here that are aimed at the enthusiast, overclocker, and workstation markets! Fobbing them off with some crappy TIM when the previous generations used a superior method is shameful, no matter how you try to spin it.
The micro cracks will also decrease the thermal conductivity but will especially increase the thermal resistance at the corner of the DIE. Without the gold layer between diffusion barrier and solder preform, delamination of the solder preform would occure after few thermal cycles. Micro cracks occur after about 200 to 300 thermal cycles. A thermal cycle is performed by going from -55 °C to 125 °C while each temperature is hold for 15 minutes. The micro cracks will grow over time and can damage the CPU permanently if the thermal resistance increases too much or the solder preform cracks completely.
Oh it's not easy is it, AMD do it for all their CPU range but overpriced penny pinching Intel can't because max profits is better than giving the consumer a properly cooled chip. **** Intel.
So it's not a problem then.From my understanding solder cracks only appear due to the extreme temperature changes. Surely you won't get this during home use of a Chip.
It means it's easy enough for smaller company to do it and still make money.Oh, and just because AMD does it, doesn't mean that it's easy to do.
It means it's easy enough for smaller company to do it and still make money.
In what way? We already have several generations of chips that use TIM and, particularly now that Intel is relying on their superior clock speeds, it struggles to keep temperatures under control when overclocking compared to traditional solder.People in here are acting like Intel don't know what they are doing regarding their thermal interface. It's laughable.
People in here are acting like Intel don't know what they are doing regarding their thermal interface. It's laughable.