So why aren't we seeing 3nm TSMC branded M2s and M2ultra? Come on, it's you that are not thinking this properly.
TSMC managed to crack the 3d stacking and packaging technology and offered that service to their clients. Just like they offer 7nm, 5nm, 3nm fabs. What's the difference?
TSMC's 3DFabric offers our customers the ultimate flexibility in product design, brings packaging technologies to the forefront for innovation, and are critical to a product's performance, function and cost:
They have the packaging technology, it takes a CPU architect (this being AMD) to design the product.
I can design an NVMe external storage housing that can regulate the NMVe drives temperatures to keep it at optimal performance, send the CAD to a Chinese manufacture, not just any, one with the tooling to make the product, but that is their part in it, they make it, i designed it.