I would say memory with significantly more complex logic. HBM is essentially the tick, where the interface was the new bit and they went with relatively simple memory/logic design. The tock step is to use the same interface but focus on a significantly more complex chip, lower power usage, lower latency, better/more parallel access, increased density. Will it be called HBM3 or a completely new memory type, doesn't really matter. The next memory change will be more like gddr3 to gddr5 most likely. The interesting parts of HBM are less the chips and more how it's all put together. TSVs, die stacking, interposers, very wide bus. the next gen memory will also be tsvs, die stacking, interposer and very wide bus, just a different type of chip stacked together.