2.5 Timing
The GF 7nm process is expected in the second half of 2018. The Intel 10nm is already late and I am hearing late 2018 and possibly even 2019 before it enters production. This presents a fascinating change in the semiconductor industry. Intel introduced 45nm, 32nm, 22nm and 14nm in 2007, 2009, 2011 and 2014 respectively. For many generations Intel was on a 2-year process introduction cadence, now they have gone to 3 years and 4+ years and while their scaling at 14nm was such that even at 3-years their yearly scaling pace was unchanged, they are now drifting off of that at 4+ year. It also begs the question of when Intel will introduce 7nm, are we now looking at 2022 or 2023?
In the mean time TSMC introduced 10nm in 2016/2017 and 7nm in 2017/2018 with 5nm due in 2019 and 3nm development underway. Samsung also introduced 10nm in 2017 with 8nm due 2017/2018, 7nm due 2018/2019, 6nm and 5nm due in 2019 and 4nm in 2020. GF is introducing 7nm in 2018 with a shrunk version due around 2019. GF hasn't discussed 5nm yet but I would expect it this decade. With the foundry 7nm processes similar in density to Intel's 10nm process and several foundry generations likely to come out by the time Intel introduces 7nm, I would expect a significant density advantage for the foundries over the next several years.
2.6 Performance
I wish I could offer a performance comparison between the processes but based on disclosures to-date I can't. Intel is focused on microprocessor performance and GF and the other foundries are more focused on the mobile space and power for performance, beyond that I don't have anything definitive to say on performance.
3.0 Conclusion
Comparing Intel's 10nm process to GF's 7nm process they are more similar than they are different. Since both companies are solving the same difficult physics problems this is in some ways not surprising.
The surprising part in my opinion is that GF at 14nm stumbled so badly they had to license it from Samsung. Now they have an internally developed 7nm process that matches up well with Intel's latest 10nm process.
It is also surprising to me to see how far Intel has fallen from the process lead they had. First with HKMG by several years, first with FinFet by several year, I suppose they are still first to do cobalt interconnect but in terms of process density the foundries have caught them and appear poised to take a substantial lead over the next several years.
With Intel offering foundry processes and GF, Samung and TSMC all offering leading edge processes the industry now has four viable leading edge process options.