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AMD Zen 3 (5000 Series), rumored 17% IPC gain.

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More than likely Jan at CES 2021. I doubt they can get this all sorted for October. This also supports what the MSI guy said that B450 would be supported in 2021.

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A 5nm chip with a 17% IPC gain and probably 5Ghz boost. Goodnight Intel.

@CuriousTomCat No AMD is just looking to mess with Intel harder. This information refers to Zen 3.
 
Defiantly seems strange. You would have thought Zen 3 is already done and dusted they will be tweaking final clock speeds and would have virtually ready to be binned and boxed up for an end of year launch.

Happy to be wrong though.
 
Doobedoo said:
Oh ok. Some 5nm goodness it is then.

One more thing is this something like the transition from 14nm 1000 series 12nm 2000 series. A half node.
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They are just not messing about anymore.... going for Intel's jugular.... probably sick to the back teeth of Intel plastering "gaming" related slogans all over their marketing material.

*Shut the #### up Intel* :D
 
humbug said:
They are just not messing about anymore.... going for Intel's jugular.... probably sick to the back teeth of Intel plastering "gaming" related slogans all over their marketing material.

*Shut the #### up Intel* :D
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No it can only be a good thing. I wonder what made them do it though. Are they going for the jugular or do they know something about the next gen Intel that made their mind up for them.

This comment makes sense.

It sounds ridiculous but when you think about it, AMD would have to either :
- launch a product that would be unavailable for months because of Playstation, Xbox, Radeon and Nvidia
- just launch the product like 3 month later with a better process and have actual availability probably equivalent to if they chose to stick with 7nm (that is, if the design can "simply" be ported to 5nm)
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Doobedoo said:
No it can only be a good thing. I wonder what made them do it though. Are they going for the jugular or do they know something about the next gen Intel that made their mind up for them.
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Maybe.... tho to me AMD have been holding back, they didn't need to split the CCD's into CCX's with Zen 2, they could just as easily made them single CCX 8 core dies and probably saved on die space, that would have made them at least equal to Coffee Lake in gaming performance.

IMO this split CCX thing was a choice, scared of how Intel might react if they had nothing that they could market their CPU's on. Like backing the monster into a corner, the last time AMD did that to Intel their reaction almost bankrupted AMD.

I hope this is AMD finally growing a backbone and just taking Intel head on.
 
Here is TSMC's process node and how they stack up:

TSMC 7nm (N7P)
+7% Better Performance at same power versus N7
10% power savings at the same performance versus N7

TSMC 7nm (N7+)
+10% Better Performance at same power versus N7
15% power savings at the same performance versus N7

TSMC 5nm (N5)
+15% Better Performance at same power versus N7
30% power savings at the same performance versus N7

TSMC 5nm (N5P)
+7% Better Performance at same power versus N5
15% power savings at the same performance versus N5
 
Destination said:
I very much doubt that to be true, they won't skip an entire fab line.
They won't pulmp their whole line on an untested process, they'll use the 7ev, and run with it
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The CPU chiplets are tiny, about the size of a fingernail, they get about 1200+ chiplets out of 7nm Wafers. They don't take up a large capacity.

What they might be doing is moving the CPU chiplets to 5nm, the IO die to 7nm (up from 12nm) they might be expecting to sell a lot of 7nm+ RDNA2 GPU's and need to free up 7nm+ capacity.
 
humbug said:
Well..... it seems suddenly TSMC have some spare capacity.....

Trump's trade war with China might be paying dividend here, The Trump Administration banned any foundry using US technology from exporting to Chinese companies, that includes TSMC who have now dumped Huawei.

Bad news for them, good news for AMD.

https://in.mashable.com/tech/14061/...es-to-block-huawei-from-global-chip-suppliers
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Yeah that could have quite a big impact TSMC would have done that with AMD and Nvidia in mind as buying up the capacity at no loss to them maybe even at a higher price
 
humbug said:
The CPU chiplets are tiny, about the size of a fingernail, they get about 1200+ chiplets out of 7nm Wafers. They don't take up a large capacity.

What they might be doing is moving the CPU chiplets to 5nm, the IO die to 7nm (up from 12nm) they might be expecting to sell a lot of 7nm+ RDNA2 GPU's and need to free up 7nm+ capacity.
Click to expand...

Well if that is the case, then absolutely brilliant, we shall see.
 
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