Soldato
It is actually been noted that a bit like CPUs get better at overclocking the older into production they are, the cmos sensors get better as well and maybe produce lower noise in later models.
That would explain the DF's DXO iso score.
It is actually been noted that a bit like CPUs get better at overclocking the older into production they are, the cmos sensors get better as well and maybe produce lower noise in later models.
What is being fabricated on the Toshiba lines will be based on what is technically possible to be fabricated using that tech. Nikon will have designed based on that. Toshiba would make no money building a bespoke fabrication facility selling sensors only to Nikon. Unless Nikon pay them very well of course!
I'm not discounting the fact that some Toshiba tech may be in some of the sensors that have a Toshiba name printed on it but Toshiba don't need to make a bespoke fab facility to create an entirely Nikon designed sensor. Just like TSMC don't make a dedicated facility just for Nvidia as An Exception points out. Silicon wafers are produced and fabbed, there is then some assembly into the packaged chip with the other components (read out lines, power circuitry, filtering etc.). This outer packaging is most likely what the Nikon design has to conform to facilitating easy production with existing facilities at the plant. The silicon design could be anything that is supported by the facility.
This rumour sounds interesting. All I would want is 9 or 11 PDAF points and a fast way to select them.
Perhaps something like this will replace the xpro.
http://www.fujirumors.com/weather-sealed-x-with-better-af-than-x-e2/
The raws look like they process really well to me in lr5.
Only the brown one left in stock at Amazon now which is annoying as it's £50 more, I was keen for a cheap one.
used xpro 1's go for around £500 on fleabay.