Has anybody tried direct die cooling with or without the der8auer 9th gen OC frame? I've seen one example of direct bare die cooling on another forum but I don't recall anyone here mentioning it.
Or has anyone here delidded their 9900k and replaced the solder with liquid metal?
I have a replacement copper IHS (with larger surface area) and a die frame on the way so I am going to be trying both. I may even do some benches to compare:
- stock
- delidded and liquid metal
- liquid metal and a larger IHS
- Direct die with the der8auer die frame
I was originally planning to do this when needed to get the last few mhz out of the cpu, then (with the new ihs sitting there, tempting me) i was thinking of possibly doing it in the summer to reduce temps. Now with the release of the die frame I'm thinking of perhaps doing it sooner to take advantage of the cool winter weather and lower ambients.
In terms of temps I know the die frame should be the coolest, but i had ordered the replacement ihs long before the die frame was released. Since i have the opportunity to compare the various options I'm curious to see how much difference each approach offers. Time permitting ofc.
My 9900k runs cool and doesn't need delidding even at 5.2. This is purely for fun and (originally) as a way of getting extra performance if needed in the future.