http://innovationcooling.com/application.html
Note on Application amount
In addition to the 2 dimensional area coverage, the dimension of the void space between sink and HIS must be added in. Intel, for example, has a spec of Flat and parallel // to .002. - To fill that gap/volume, a .05 ml volume of compound is needed for a 30mmk X30mm area, about the size of a grain of rice.
The other side of the thermal joint equation is the heat sink base. The heat sink bases may vary as much as .010 and, to cover the contingency of irregular contour on both sink & HIS, .1 ml should additionally be added for a total of 0.15ml.
Another issue is Laplacian Growth which occurs when inadequate amounts of paste form viscous, finger-like extensions and reform to encapsulate air into the joint. These air bubbles, with heat and pressure, expand and create voids which degrade thermal performance and reliability.
To counter this process, the addition of another .05ml to the application amount is recommended making for a total of .2ml of IC Diamond.