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Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report

Or to make Sandy Bridge appealing still, if Ivy Bridge was better in every department they would probably be lumbered with a whole heap of stock that they can't shift.

Nah they have been making the performance of the new SB chips "worse" from what I've been hearing people are now struggling to get past 4.4Ghz.
 
Obviously Intel didn't want to make all there other CPU's suddenly seem irrelevant if Ivybridge could have reached 6.0Ghz. I don't think it was wrong for them to limit the overclocking, there a business, they have Sandy - E range for ultra performance, Ivybridge is mirange low power chip. Why should they give all this performance at £250... People expect to much imho. If you want ultra performance you have to pay for it and go Sandy E...

My 3770K @ 4.6Ghz gives similar performance to my old 2700K @ 5.0Ghz, surely this enough for most people?

Actually you're 3770k @ 4.6Ghz gives 4.8Ghz on SB. also the i5's for IB are "midrange" SB-E is enthusiast chips and come into a completely separate category.
 
I am very keen to know if the plan will cover it, if so then I definitely will give it a go.

With the best will in the world, there's pretty much no way Intels insurance plan will cover the self removal of the IHS, can you imagine the sheer volume of claims that could potentially involve?.
 
Actually you're 3770k @ 4.6Ghz gives 4.8Ghz on SB. also the i5's for IB are "midrange" SB-E is enthusiast chips and come into a completely separate category.

Ha, so you're telling me how my own chip performs :rolleyes:.

I get similar performance from my 3770K @ 4.6Ghz as I did from my 2700K @ 5.0Ghz, that's using my own PC, my own testing. Nice of you to tell me how it performs though :).

Also 1155 is Intel's 'midrange' mate, it may be on a new die process but it's still Intel's midrange. LGA 2011 (Sandy E) is the 'high end'.
 
Ha, so you're telling me how my own chip performs :rolleyes:.

I get similar performance from my 3770K @ 4.6Ghz as I did from my 2700K @ 5.0Ghz, that's using my own PC, my own testing. Nice of you to tell me how it performs though :).

Also 1155 is Intel's 'midrange' mate, it may be on a new die process but it's still Intel's midrange. LGA 2011 (Sandy E) is the 'high end'.

Uhm yes I am because IB performs AND has been proven by about 10 top reviewers to give 5% performance gain over SB let's do the maths shall we? 4.8/100 * 5 = 0.24 so we add that to 4.6Ghz on IB which gives 4.84Ghz at SB. Hm I would like to see you're conclusive test results of getting 5% more than everyone else out of you're IB. Really you would call an i7 3770k costing £250 mid range when it costs more than the lowest 2011 chip atm?
 
"The new IvyBridge K series processors also feature immense overclocking as well."

that was taken from the i7 3770k product description so ofc ppl will think it overclocks just as good as the SB's if not better so looks like false advertisement to me

It could only be claimed to be false advertising, if they had put a value on the overclocking potential of the new IvyBridge K series chips, which clearly they have not. ;)
 
For the hardcore over clockers the fact that you can remove the heat spreader is a good thing.

I remember people were complaining about the fact that you couldn't remove heat spreaders before.

Good thing in my book tbh.
 
With the best will in the world, there's pretty much no way Intels insurance plan will cover the self removal of the IHS, can you imagine the sheer volume of claims that could potentially involve?.

less than 10% as not many are enthusiasts? 10% of 10% due to the risk factor? so 1%?..........

complete guess but probably more likely to be right

Even if they don't cover such things I am still intrigued and may give this a go depending on more gathered findings and/or a less hazardous process of IHS removal.

As I said previous, it is not bonded to the CPU, it seems like it is there for removal and/or cheap to simply suction it on.
 
For the hardcore over clockers the fact that you can remove the heat spreader is a good thing.

I remember people were complaining about the fact that you couldn't remove heat spreaders before.

Good thing in my book tbh.

yup and may be another reason why the policy 'may' cover it, by chance. It would only effect 1% of all enthusiasts doing it, and as it was a choice made by intel maybe they had the enthusiasts in mind...not we simply need a formal process of IHS removal and/or a simplified safer guide!
 
found another bit of info about this:
http://translate.google.com/transla....jp/docs/column/sebuncha/20120511_532119.html

just wondering about the liquid pro though.... think that it spilled over as he just put too much on or? that would be my only concern as like most cases the cpu is up on it's side... don't want it dripping about xD

Very nice article. It may well be worth a try, it doesnt look too difficult if you take an hour or two being EXTRA careful.

Oh and the liquid pro, it looks like you only apply a little. The pics look like there is too much applied but still it isnt spilling over.

Is double sided tape considered useful or not necessary?
 
Very nice article. It may well be worth a try, it doesnt look too difficult if you take an hour or two being EXTRA careful.

Oh and the liquid pro, it looks like you only apply a little. The pics look like there is too much applied but still it isnt spilling over.

Is double sided tape considered useful or not necessary?

don't know who ya talking to ;) when i did my mass upgrade of parts in feb it took me 3 days to strip down my pc, clean everything, and then put it all back together nicely with cable management. I don't rush these things :D

when i bought my z77, ram, cpu, 2nd ssd and a replacement 3.5" HDD took me 6ish hours to take the old stuff out and the new stuff in xD (i did have to drive to the people in purple shirts to get a molex to sata power lead though as i couldn't get my power lead to reach everything, raven rv-03 with all the back bays filled except the bottom left which is stuff full of excess cables xD)

look at the last picture before the voltage/frequency table and tell me that hasn't spilled over :p i would think the double sided tape would be useful in the fact it can just stop the IHS from sliding about when moving the chip into the socket before clamping it down. not sure what it would do under heat tho :p
 
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don't know who ya talking to ;) when i did my mass upgrade of parts in feb it took me 3 days to strip down my pc, clean everything, and then put it all back together nicely with cable management. I don't rush these things :D

when i bought my z77, ram, cpu, 2nd ssd and a replacement 3.5" HDD took me 6ish hours to take the old stuff out and the new stuff in xD (i did have to drive to the people in purple shirts to get a molex to sata power lead though as i couldn't get my power lead to reach everything, raven rv-03 with all the back bays filled except the bottom left which is stuff full of excess cables xD)

look at the last picture before the voltage/frequency table and tell me that hasn't spilled over :p i would think the double sided tape would be useful in the fact it can just stop the IHS from sliding about when moving the chip into the socket before clamping it down. not sure what it would do under heat tho :p

haha well if time is there it should be spent making sure everything is checked, double checked, tripple etc :D

The more people that do this successfully, the more likely people are to do it out of confidence. The fact that there is a thread about it which is constantly growing in depth, but very few people posting they have tried it, is the only thing holding me (and I presume others) back :D
 
What I'm hoping is that this isn't going to start a trend, and the do the same thing with haswell.

Though I figured perhaps most of the reason they were able to go on the cheap here is because IVY is only rated to 77W, and most of them are 65W and below, so perhaps that was just low enough to use crappy thermal interfaces. Haswell, on the other hand, will go back up to 95W, according to the slides they've released about it, so hopefully they'll go back to solder.
 
just asked a japanese colleague of mine to do a better translation than google of the picture with the liquid pro seeming to have spilled out to the sides.

it's not actually spilled but because it was under pressure and essentially stuck together, when he took the IHS back off with the knife, the pulling the two surfaces apart caused the liquid to shear stress, resulting in the splash... so not actually leaking out but just splashed because of the stresses on the liquid pulling it apart. so completely fine in my eyes :)
 
Should not be any more difficult than balancing a 1kg copper thermalright heatsink on a thoroughbred or barton die and fixing the crappy spring clips.

If I had one of those processors, I would certainly give it a go :)
 
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