OCUK Official IC Diamond/ Perihelion Test Results

Reading paste impressions

Paste impressions:

Poor mounting pressure

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good mounting pressure - difference between mounts -6 C - light glaze

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Another example - Contact paper sample with paste impression of the same mount

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psychas said:
just arrived 24 carat one , took 1 month to arrive almost gave up on it , will pick mx-3 on Wednesday will start testing then.

edit: 1090t @ 4ghz 1.4125 vcore in bios , Corsair h-70 Apache blacks push & pull , case antec 902 , should i read core temps or cpu temps ? i try reapply again maybe i did something wrong will do gpu later

Before Compound: Arctic mx-3
Ambient Temp: 22.3 c
Idle Temp: 25 c
Load Temp: 50 c

ICD/Perihelion
Ambient Temp: 21.9 c
Idle Temp: 23 c
Load Temp: 47 c
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3 10th's of a degree off the average more or less, as these things go pretty good effort - thanks for taking the time to test

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WingZero30 said:
I am awaiting contact & pressure paper(s) so I can optimize contact in one go and don't have to keep taking apart my PC. I have some Zalman ZM-STG2 thermal compound aswell which I can use to see how the pattern is turning out and posting pics here,before actually using the papers.

This will also be useful when comparing the IC Diamond pattern which I am using as it has been about 2 weeks now since my last post although both compounds have different density/viscosity.

As I am also approaching my final testing I would want to make sure that my last testing is as accurate as possible hence there are still some factors which I need to discuss before actually carrying out the testing.

I am thinking about my previous tests as a stepping stone and as a learning experience for myself in that some mistakes were pointed out and yielded some further understanding about the whole process from an end user.

However I am surprised the thread has gone quiet now.
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Thread is getting a little long in the tooth. I'll write up the final report in the next couple of weeks and will update it with new info as happens.

This is one for you WingZero30 now you are the resident C/P expert - Below laptop chip 1.3 sq centimeters of area @ 35 W - so what happens to a compound when you lose 25%-50% if the contact area on a chip this size?

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No IHS on this one, so direct contact area is smaller so the watt density is higher.

Kind of like here

http://forums.overclockers.co.uk/showpost.php?p=18767784&postcount=285

The compound had an early failure

The C/P image above is from a laptop, our first to date. We are in the early stages of gathering long term data on the laptops and you have real diverse mix of temperature experiences some of the compounds tested here only last from a few weeks to a year. IC Diamond seems OK at a year to about a year and half give or take with only one at 2 years contrasted with a guy over at Anandtech who is 4 years on ICD on a PC.

The increased watt density is a killer and I suspect the early failures are low C/P in numbers something like the Pareto principle aka the80-20 rule

I was taking a look at some published information on laptop reliability linked below and a rough analysis might be with their 30% failure rate in 3years approx 1/3 of that due to breakage and about 2/3 or 20% of all laptops is a component failure probably due in large part to high thermal loads - Heat is number one enemy of electronics.


After a re-paste on a PC in the overclockers forums you have an average of 61C after a repaste and the laptops so far average 71 C after a re-paste. I think the extra 10C is the dividing line, in the PC market you may see a few degrees decline and here and there you get the rare 15 -20 C degree improvement but generally most of those are mount related issues unless the compound has been installed a couple of years or more.

The PC failures were generally less than half laptops. The prevalence of early temperature creep in laptops is quite surprising along with the relatively large number of 85 - 90 C systems reported---- 25 to 30 C higher than the PC's, if you have a weak component those kinds of temps have a good chance of killing it. As a kind of general recommendation to avoid being the 1 in 5 failures and as a good maintenance procedure has been suggested here blowing the dust out regularly, I would add a secondary laptop cooler as well as changing the compound every-time it creeps up 10 C past the initial install temps. The cooler it is and the longer time periods it remains cool, the odds that longer system life increases.


http://www.squaretrade.com/htm/pdf/SquareTrade_laptop_reliability_1109.pdf
http://cache.gawker.com/assets/images/4/2009/11/500x_squaretrade3.jpg
Gartner Says Annual Failure Rates of PCs Are Improving, but Manufacturers Can Do Better
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Lots of good info obtained. Raw images reveal much as well as pictures of paste impressions

I cannot find the exact full die size but then have not looked too hard yet but initially pressure is very good as I suspected it would be and contact appears to be around 50% - 60%, 9/10 th's of a centimeter

So basically you have half the area for dissipating 35W - +2X the thermal stress on a compound in an environment that is already warmer than most to begin with, little wonder why people are experiencing accelerated compound degradation.

I currently have 3 people on tap for C/P laptop testing it would be nice to get a broader profile of 20 to 30 and to see how things trend.



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Looking at the CP image along with the paste patterns the "glazed" top and bottom are the high contact and pressure areas. The larger "globular" compound areas line up as low contact and pressure.

Bottom more pressure than top and middle region ls now the low contact area.

Perhaps with the added pressure there is some flex in the IHS? Sink?

Try the patience of the best mechanic - not easy...

Contact kind of follows a tripod alignment with the contact mostly on the three highest points.

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However I have noticed that in my previous sensor product results, the total area is always quoted around 2.78-2.91 sq.in. How do they calculate this value?
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They just take the paper size assuming that the person submitting the sample is aware of the total contact area.

As as general rule I usually check the Itel supplied dim. which I believe is 30mm X 30mm

I expect from your print you are in the 60%+ range - Send back your best print and I will get a lab analysis done.

I think right now you are kind of on the ambient noise of the mechanicals little tighter, little looser, little to the right or left.

Without more lapping you are where you are give or take with pressure probably the more dominant factor
 
Just back from vacation -WingZero30 I did get your CP results and will have processed next week currently battening down for a little tropical squall this weekend

Lost my home PC due to lightening strike(s) So a couple days reconfiguring all and should wrap this up test results next week.
 
Good analysis pretty much working on the same contact pattern as you noted. The bowed bases whatever their advantages start with about 30% of the contact area by design and so more susceptible to secondary that influence in contact and pressure, unstable might be a better word so needs more detail to get just right.

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so back to figure 2 where heat has flow across the IHS. I should have several more WB impressions in the next couple of weeks and hope we can get some that have a better contact and we can define the limits,with a couple of curves, my guess it's a thin line.

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Been dealing with some health issues but back on track and putting together a final report which should be done in a day or two -My apologies for neglecting you people.

In any event some laptop Contact and Pressure images on a compound reliability study we are doing to pas the time - Little wonder that Notebooks see such high temps and compounds are subject to early failure, contact of only a few mm with 30 to 50W put the stresses in the soldering iron category

So out of the 5 CPU's Tested so far 4 are trending less than 50% contact which will greatly impact performance and long term reliability.

too456 Acer8

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