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Possible Radeon 390X / 390 and 380X Spec / Benchmark (do not hotlink images!!!!!!)

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If this assumption by Guru 3D is correct it will still be many months before any cards are actually made.
It takes quite a while for these complicated chips to be created ( I cannot remember the exact timeframe but its one of those things that DM has explained before very well, maybe 'Hint Hint' he could do so again) and as we know very little in this industry is kept secret for very long. If GF were going to spring some super fast cards out for AMD I'm sure there would be more than just the forum babble to indicate that this was happening.
 
No, it won't be "many months" because the Hawaii v2 is clearly supposed to fill the gap until Summer.

Yes but I was meaning that it will be many months before Global Foundries produce any of the chips that this news (assumption) is talking about.
 
Hawaii v2 most likely already has taped out, been verified and is now coming out of the oven if it's real. It could easily be on one of GF's 28nm processes.
 
Hawaii v2 most likely already has taped out, been verified and is now coming out of the oven if it's real. It could easily be on one of GF's 28nm processes.

I hope so, but I haven't seen any Tape out news and that sort of thing is definitely not normally missed.
 
No, it won't be "many months" because the Hawaii v2 is clearly supposed to fill the gap until Summer.

Yeah this is coming soon, Jan / Feb 2015, followed by cards based on new architecture in summer 2015.

Looking forward to new AMD cards, let's hope they are a big leap and not another round of incremental milking from both camps.
 
Looking forward to new AMD cards, let's hope they are a big leap and not another round of incremental milking from both camps.

Unless redesigned a lot incremental is what happens on the same node (Intel aside)
efficiency goes up as well power draw goes down but we are about to hit a wall with die shrinks so they cant rely on that to do better from any brand.
14nm is when we are likely to spend 4 years on unless innovation happens.

I loaded popcorn and whiskey as once those who bought Nvidia cards get the buyers remorse :D
 
If this assumption by Guru 3D is correct it will still be many months before any cards are actually made.
It takes quite a while for these complicated chips to be created ( I cannot remember the exact timeframe but its one of those things that DM has explained before very well, maybe 'Hint Hint' he could do so again) and as we know very little in this industry is kept secret for very long. If GF were going to spring some super fast cards out for AMD I'm sure there would be more than just the forum babble to indicate that this was happening.

Rules changed, significantly. I'm under the impression that tape outs at 20nm and below are significantly increased in time frame. IE 6 months was maybe normal at 40nm, maybe a tad longer at 28nm, it now might be closer to a year. More complex chips, having to move to double patterning which is where most of the issues with cost increase have come from.

http://www.extremetech.com/computin...hography-technique-to-push-moores-law-to-20nm

pretty good basic idea on it. current lasers are producing 193nm lightsources which do a surprisingly good job of etching 28nm chips, 20nm means double patterning and longer tape outs, more complexity in taping out, more yield problems, take longer to produce(ie chips might need 8-10 weeks rather than 6 weeks which effectively reduces throughput of wafers by a huge amount.

Less wafers with lower yields and higher costs... EUV will hopefully bring with it higher yields, less complexity, cheaper and higher volume(from the same fab size basically), which will all combine to make for significantly better value chip production. 20(and fake 14-16nm).

In terms of when these chips would be made, you need to know when they taped out and how long the tape out is.

GloFo have always been quiet in a general way. Charlie has had sources but aside from that few/any other people manage to call GloFo tape outs. TSMC is a leakfest which is the reason we find out about tape outs. The next gen of AMD gpu's could have taped out 12 months ago at GloFo and be about ready to launch, who knows.

I did see a nice design to product launch comparison from one node to the next including the estimates for 20-14nm... but I can't find them again. I think we were looking at 9-12months for most likely a TSMC tape out for 20nm and I think another month or two for 14nm finfets.


Anyway, there is no conclusive info which process or where they'd be made. There are really too many possibilities. 14nm finfet bulk Samsung/Glofo, 16nm finfet bulk TSMC, 20nm bulk TSMC, 28nm bulk GloFo or TSMC, or the newer 28nm FD-SOI GloFo. 28nm FD-SOI is going to be EXTREMELY competitive if not outright beat 20nm bulk and may not be far off bulk finfet processes. 20nm FD-SOI sounds like it's a pretty long time away and will likely not be available till 2016 and beyond.

Nvidia will almost certainly be making chips only at TSMC and only on 20 or 16nm, with AMD... it could be almost anything to be honest.
 
There is also the option of 28SHP which APUs and such are already using. It is supposed to be comparable to FDSOI but not sure if that's FUD or not.
 
Reading between the lines from AMD's comments, it looks as if the upcoming interim GPU to take on the 970 / 980, will be based on 28nm but using HBM. So a combo of cutting edge tech and established node so that it's a cost effective solution until a new node transition is available later in 2015. Cooled by an AIO to keep it running nice and cool / quiet.

My guess is, upcoming card:

28nm.
HBM.
AIO Cooling.
3000+ Shaders.


Summer 2015 Cards:

20nm/14nm.
HBM.
Air cooling. (Except Dual card)
4000+ Shaders.
 
Reading between the lines from AMD's comments, it looks as if the upcoming interim GPU to take on the 970 / 980, will be based on 28nm but using HBM. So a combo of cutting edge tech and established node so that it's a cost effective solution until a new node transition is available later in 2015. Cooled by an AIO to keep it running nice and cool / quiet.

My guess is, upcoming card:

28nm.
HBM.
AIO Cooling.
3000+ Shaders.


Summer 2015 Cards:

20nm/14nm.
HBM.
Air cooling. (Except Dual card)
4000+ Shaders.

I want the Dual card so i can go back to quadfire.
 
20nm and 14nm are not suitable for GPUs, we've been through this before...

The only option for a Summer launch is 28nm. There are now ways of making 28nm chips that are better than regular 20nm however. Anything after about July or so you should expect 16FF+ from TSMC. But if AMD are staying loyal to GF that leaves them without an option for a proper shrink.
 
20nm and 14nm are not suitable for GPUs, we've been through this before...

The only option for a Summer launch is 28nm. There are now ways of making 28nm chips that are better than regular 20nm however. Anything after about July or so you should expect 16FF+ from TSMC. But if AMD are staying loyal to GF that leaves them without an option for a proper shrink.

Ha, so you think AMD won't have a die shrink at all. You crazy mate :p. We'll see 20nm or 14nm FinFET (14LPP) used by AMD if they don't go with TSMC.

Of course they will get a die shrink lol. So yeah,

My prediction is,

Upcoming card:

28nm.
HBM.
AIO Cooling.
3000+ Shaders.

Summer 2015 Cards:

20nm/14nm.
HBM.
Air cooling. (Except Dual card)
4000+ Shaders.


What's yours?
 
If you don't want to listen, nothing else I can say! If you read around on industry sites and more technical forums you will see it for yourself. This wishful thinking not backed by anything doesn't get us any insights.
 
Literally every tech forum I read has people who work/ed in the semiconductor industry reporting you can't make a GPU on any 20/14nm process. The dies are 3x over the limit of what is currently acceptable size wise to be profitable. Too leaky. Yields are awful even for phone chips. Too much compromise to hit yield targets.

Meanwhile Boom is on here every day making "predictions" every time a new piece of clickbait pops up on wccf et al, based on nothing.
 
I'm not :D

Upcoming card: probably late Jan/Feb, but maybe announced last minute before Xmas

28nm.
GDDR 5 memory
Air Cooling.
3328+ Shaders.

Autumn/winter 2015/16 Cards:

not 28nm
HBM.
Air cooling. (Except Dual card)
4000+ Shaders.
 
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