For somebody like me that considers upgrading the old failed experimental build of mine, from a hot eight core 14nm 1800X cpu, to an eight core 7nm 3700X, I am a little cautious as my former experiment with passive cooling didn't yield satisfactory results in terms of cooling.
Now, I think I have learned that the chips inside the lid of the 3700X, is not simply around the center, but on the opposite side of the tiny arrow in the corner, and, compared to the Crossfire VI Hero motherboard cpu socket, the two outlying chips are apparently in a row facing from front of cabinet to rear end. And.. I can see from my current install of the huge passive cpu cooler I use for my 1800X (been stored away sadly), that the four heatpipes also goes in the direction of front case side --> rear case side, which I would think have two pipes covering the bottom chip, and the other two pipes covering the other two chips. I guess, it would perhaps be better if the four heatpipes on my cooler, could instead be rotated 90 deg, so that pairs of heatpipes, covered at least two chips each. Any thoughts on this line of thinking? I don't readily know, if I can simply rotate my cooler 90 deg, haven't checked.
Edit: Hm, I just realized that the triangle in the socket on the mobo, is on the left bottom side in the photo, still, that make the heatpipes go from top of photo, to bottom, or, from front to back inside the case.
https://ibb.co/C58nbF7 (mobo, image replaced)
https://ibb.co/vxjPK9x (overlay of heatpipes over cpu, unsure if entirely accurate)
Q: What are the three chips on the die on the 3700X?
A: From an article: Supposedly, the two chips on top are CCD's (7nm) and the bottom chip is I/O chip (12nm).
https://ibb.co/0mppkTZ (AM4 chip third gen architecture illustration)
"As with Zen and Zen+, Zen 2’s CPU cores are further subdivided within an 8-core CCD into two quad-core Core CompleXes (CCX). " I guess the two top CCD's are where the eight cores are. I wonder what get more hot, the cores, or the I/O chip below.
"The actual processing happens on one or more CCDs, while the IOD contains the memory controller, high-speed I/O, and other functions." I guess, maybe the eight cores get more hot, than the I/O chip.
Source:
https://techreport.com/review/34672/amd-ryzen-7-3700x-and-ryzen-9-3900x-cpus-reviewed/