NeelyCam
Continuing a long history of innovation, AMD announced today that they were the first to reach a critical CPU power envelope threshold. AMD CEO, Rory Read, was visibly pleased with his company's progress as he was announcing this new development.
"Through creative innovation and company-wide alignment, we have now achieved something our competitors can only dream of. We are proud to announce that our new, 8-core flagship FX-9590 has reached and surpassed the previously unattainable goal of 200W TDP. The demand for this new product is strong; the first large-scale server deployment contract in Northern Alaska will be announced early next week."
AMD is also planning to continue developing this new product line with annual refreshes. Said Read: "We have a clear roadmap for these products for the next three years. Our 2014 platform, codenamed Sauna and fabricated on a 32nm process, will reach 250W TDP. In 2015, we will release a 20nm refresh codenamed Nucular, that will increase TDP up to 30% or more - this will be available for Back-To-School season. Finally, by 2016 Holiday season, we will release a product codenamed Solara - a new architecture that takes TDP to unprecedented levels. More details about Solara will be announced at Computex 2014 - stay tuned!"
After trailing their main competitor,
Intel, for years, it looks like AMD is back in the game. Intel has been slow at improving TDP lately; the new desktop Haswell CPUs were released with a disappointing 84W TDP. The recently announced Ivy Bridge E platform promises to improve TDP, but the new FX 9000-series products from AMD seem to have leapfrogged the competition. Intel representatives declined to comment on this story.
As always, I would wait for independent benchmarking results, but judging from the heat and excitement in AMD's demo room, this reporter has a feeling that AMD has finally nailed it - these new CPUs sure look HOT!