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AMD to unveil Zen 4 CPUs at CES 2022

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Info leak from wcftech's "sources"

* Zen4 will be announced on 29 August

* Reviews go live on 13 September

* Launch and general availability 15 September

* Launch with 4 SKUs: 7950x, 7900x, 7700x and 7600x

* X3D Zen4 models to launch later this year

* Zen4 tops out at 170w, boost clocks are very high compared to Zen3. 7950x has 170w TDP and a 5.7ghz single core boost clock and 4.5ghz base clock.

* 7600x has 105w TDP

* Overclocking with voltages is disabled. Like AMD did with 5800x3d, all Zen4 CPUs will have their voltage hard capped out of the box. You will be able to undervolt the CPU but going over won't be an option (officially) but users will find ways around it. It's not clear if this means PBO overclocking is also dead


 
Seems AMD is pushing power hard. Both 7950x and 7900x have the 170w TDP profile which includes boosting to 230w at stock under full multithreaded workload. The 7600x has been given the 105w profile up from 65w that the 5600x has.

The benefit of this extra power is high clocks. Even though it seems like overclocking won't be allowed, it's probably not needed with AMD pushing these chips as far as they will go right out of the box.
 
With Intel pushing the power envelope so far its hard for AMD to compete I guess without following suit, even on a more advanced process node. Surely at those boosts, even with a small IPC uplift these chips are going to be a massive upgrade over Zen3 and surely easy a match for Intel ?
 
good guess that 7800X is reserved for V-cache model
Those boost clocks are impressive tho... Could AMD still be conservative on boost clock? (Zen3 normally used to boost 150MHz above the declared clock at stock)
Before there was a rumor that Raphael has a hard limit for clock of 5.85GHz... That would match 7950X 5.7GHz boost clock + 150MHz
 
I'm just wondering how different the clocks on the 3d v cache version will be. AMD have upped the TDP of these chips quite a bit it seems but the same laws of physics apply, isnt the issue with the 3d cache getting the heat out through the stacked cache ? if so, seems like they may need to dial the stacked version back quite a bit unless they have engineered a more refined solution on this next gen (odds are they have improved it at least a bit).
 
Stupid question incoming: I saw somewhere that AM5 will work with AM4 coolers. Does that mean an AM4 water block will work with the new motherboards/cpu? This was one of my worries in delaying my build even more so that would be great if it's not an issue.
 
Stupid question incoming: I saw somewhere that AM5 will work with AM4 coolers. Does that mean an AM4 water block will work with the new motherboards/cpu? This was one of my worries in delaying my build even more so that would be great if it's not an issue.

The Socket AM5 is physically identical to the Socket AM4.

So you can also use your AM4 cooler on a AM5 Socket.
 
Stupid question incoming: I saw somewhere that AM5 will work with AM4 coolers. Does that mean an AM4 water block will work with the new motherboards/cpu? This was one of my worries in delaying my build even more so that would be great if it's not an issue.

Yes, the CPU + socket are the same hight as AM4 and the mounting holes are the same, the whole cooling mounting system is identical to AM4
 
I'm just wondering how different the clocks on the 3d v cache version will be. AMD have upped the TDP of these chips quite a bit it seems but the same laws of physics apply, isnt the issue with the 3d cache getting the heat out through the stacked cache ? if so, seems like they may need to dial the stacked version back quite a bit unless they have engineered a more refined solution on this next gen (odds are they have improved it at least a bit).

No clue. Entirely possible AMD are solving that issue by putting the cache die and structural silicon under the CCD rather than above it to alleviate the cooling issue. Power delivery does become an issue though but I think that is probably easier to solve than heat dissipation.
 
The cache is only one third the size of the CCD, packing under the CCD is going to be more tricky than packing on top, i would think, given that the mounting pressure will push down on the larger CCD on top of the cache.
 
The cache is only one third the size of the CCD, packing under the CCD is going to be more tricky than packing on top, i would think, given that the mounting pressure will push down on the larger CCD on top of the cache.

Add in structural silicon to deal with that, or use 2 cache dies for 128MB extra per CCD...

Power delivery will be the issues I think but probably solvable so I expect that to be the solution long term even if not for Zen 4.
 
Looking forward to reviews - very tempted to jump on a 7950X & Crosshair Hero, assuming performance is there. AM5 will probably last 10 years knowing AMD, so lots of upgrade potential.

When 13900k launches I'll slot one into my z690 board, I'll use the faster one for games for my main rig, and the runner up for my VR/family rig.
 
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