TSMC has already started volume production of its next generation 7nm process; the first to incorporate its advanced EUV tech, and the node which should form the basis for AMD’s Zen 3 processors next year. The Taiwanese contract manufacturer started mass production of the 7nm+ process in March this year, which is a huge milestone for the technology, and it’s being used to create HiSilicon’s phone SoC, the Kirin 985. And if you don’t know who HiSilicon is, you’ll probably recognise its parent company, Huawei. Even if you’re not necessarily sure how to pronounce it correctly.