De-lidded 3770k!!

Thrust4Money said:
Any OC would be made easyer going from air to water without a doubt, i hear good things about the H80i
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I did have a look at the corsair ones, but I've had so many conflicting reports about them.

If I wanted to go water, I'd probably build a proper loop. Before I was a bit unsure because of just how much the temps would have to come down by, but now it's de-lidded I probably wouldn't need anything quite as extreme. By which I mean I don't need three radiators xP.
 
Ivybridge Overclocking Guide :)

It's a very comprehensive guide and an interesting read, it provides deep insight into how Ivybridge chips perform and behave under different circumstances. After you understand it, also have a read through this:

Ivybridge overclocking guide on overclock.net as it provides brand-specific bios settings. More importantly it has the very useful BSOD list that I used to debug instability on my overclock many times.

As for air vs. water, since you already have a very decent heatsink I think you will see very little difference going to an all-in-one WC setup such as the corsair H80i. You'll likely get similar results just by getting a pair of decent fans on your TPC-800.

Also your sig is against forum rules :) Maximum 4 lines of texts allowed with each not exceeding 400 pixels in length.
 
@chrisoverson I found the best temps with the last two 3770ks I have done is to put a coat of liquid pro on the die as well as the internal face of the IHS and then on the top of the IHS and my water block

might sound a lot but we talking extremely thin coats here not like your normal TIM

for those who have been running with out the IHS a few have been removing the socket retention mechanism to get better contact might want to use some sort of packing to protect the die(remember cracking one in the AMD XP days)

number 3 today (hope its even lower volts than the rest) sold the other two and made some beer tokens lol some guys need to grow some
 
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Just wondering, for those of you that de-lidded a couple months back, has the reduction in temperatures remained? I cant recall where, but saw that de-lidding might not have a lasting effect.
Intel trolls or is there something to this?
 
Woops, sorry, I've modified my sig. I'll go ahead and read through those guides, thanks for the links :)

I thought about putting liquid pro on my heatsink too, but I'd heard it can make a mess of things. Is that true? Or should I go ahead and swap my AS5 for it?
 
steve258 said:
You can always use liquid pro only between IHS and die then just use normal decent TIM for heatsink and get similar performance.
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That's what I've done for the moment - using arctic silver 5 for the heatsink and liquid pro on the IHS. Maybe I'll try liquid pro on both next time I re-seat it, and test the differences.
 
Thats what i thought when i looked at the images, just wondered wether the glue or silicon is harder to cut.
I used a thin razor blade on the older amds.
 
Could i ask what you used to pack the rest of the chip lvl with the die to stop you crushing the corner with an unlevel heatsync? It always used to be a pain finding something to fit that will let the heat sync sit lvl, but i guess someone is selling premade packers by now. I think the best thing i found was layering up packing tape and cutting it to fit the cpu.
 
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