They almost certainly use the same process, it's an improved process, nothing more or less. Kabylake wasn't a massive leap in process tech, it's a completely standard tweak, every process ever made has improved little by little over time. This is usually just improved design rules allowing narrower margins for error as the more mature process moves towards the theoretically minimums for feature size. As things get smaller you can use the same die size for slightly more performance or lower power or make the chip slightly smaller and make them cheaper. It doesn't make the process more expensive to use, it's the same equipment, the same silicon and the same time to make(in most cases, when not the difference will be marginal). In other words, for Intel not to use the tweaked process design rules would be choosing a more expensive chip for no reason at all.
There was a very small and very standard change in terms of the process for Kabylake in the first place. Back in previous gens where the gap between nodes was shorter, Intel just released the same chips with a new stepping but the same names, Q6600 C0 stepping is one that springs to mind. AMD often brought out a new stepping everyone wanted as well, it's now process nodes work. There is zero benefit to not using the tweaked process on every new chip you produce from that point forward.
but if I'm not mistake those tweaks don't get transferred all that quickly to the xeon dies.
Haswell e and broadwell e for example, Haswell e was the same process used on the consumer version (from the xeon dies) by the time broadwell e dropped it was what 6 months after skylake launched?
andbyet the used the more ineffectient broadwell die, which had morentrouvle sustaining high clocks (compare the 6950x vs the 7900x out of the box clocks, the 7900x out of the box is higher than a max oc'd 6950x)
if I'm not mistaken this is because it takes them a while to change their lcc/hcc/xccdies over to the new node.
although yes it's not a 'new' node as such it is a different process/architectural tweaks.im sure we could agree the skylake architecture would have better than the broadwell one as it was more matured and refined.
and yes kabylake and skylake are essentially identical, kabylake just has some tweaks for power efficiency to push clocks higher, I'm not sure exactly what tweaks coffeelake brings, but their claim of 30% performance improvement is interesting (if true)
overall the main temp issue was the glue used, so hopefully they've refined that process, I do think that their long term plan was to phase out soldering the hedt platform, obviously they phased it out with ivy bridge, perhaps they wanted to 'test' the consumer line before doing it together high end?
like, Haswell was poor with tim, then devil's canyon made a big improvement on it, skylake did pretty well with tim also, and kabylake has shown their adhesive is overused and creating gaps.
perhaps these last few years of tim 'trial and error' was them for what of a better word testing how to get the process down correctly before.moving to the hedt platform.
I do wonder if it's to do with their xeon line, perhaps they've had issues with some of their server chips being soldered? either in the manufacturing phase or after extended use (say 3-4 years)
this is all my theory of course