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Intel to launch 6 core Coffee Lake-S CPUs & Z370 chipset 5 October 2017

Kieran said:
Hopefully my 8700k and Asus Maximus ROG X Hero (Wi-Fi AC) arrive this week.

I am planning to reuse my existing RAM which is 'Corsair CMK16GX4M2A2666C16 Vengeance LPX 16GB' and has been running no bother at 2933 with my 6700K. I only play games - so would it be worth my while to swap this out for '8Pack Team Group Dark Pro " Edition" 16GB (2x8GB) DDR4 PC4-30900C18 3866MHz Dual Channel Kit - Black'? I game at 1440p60 with a GTX 1080ti and occasionally 4k60 on the TV. I'm guessing I could get maybe 40% of the cost back from selling my existing RAM. If it makes any difference I have a decent AIO and don't plan to delid - at least not straight away.
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Im running 8700k / 1080ti and 16GB Corsair Vengeance LPX @ 3000 for 1440p gaming on a 144hz gsync monitor. You will not need to do anything with your ram for gaming trust me. Everything is just so much better and thats having the same 1080ti in a 4770k and 7700k. The only reason i upgraded is my 7700k mobo lunched itself two days after getting my7700k in the post so i RMA'd it and got the 8770k on release. Benchmarks are only showing small fps gain on all of these review sites but a lot of these games that use multicores now are just so much better.

Set up your system first and then if youre not happy get the 8pack memory but im happy sticking with what ive got at the minute. I know people may bash me for it but i mainly game and overclocking is secondary.
 
8 Pack said:
Just use paste..normal paste. Hydronaut is Thermal Grizzly paste designed for water cooling.
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i ended up using some year old arctic silver i used a year or so ago. Does this stuff go off or will it be ok on my system?

The temps seem ok around 72c average @ 5.1Ghz, gaming is only mid 60's. I just dont want it to slope off if the thermal properties degrade over time for the sake of 7 quid thermal paste.
 
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Blueglue said:
i ended up using some year old arctic silver i used a year or so ago. Does this stuff go off or will it be ok on my system?

The temps seem ok around 72c average @ 5.1Ghz, gaming is only mid 60's. I just dont want it to slope off if the thermal properties degrade over time for the sake of 7 quid thermal paste.
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Scrap the last ive just ordered some Thermal Grizzly Hydronaut. Whats the point in spending 700+ on a new cpu and mobo and cheaping out on the surface contact.
 
So whats the general consensus...

Once you delid the chip (if you do it yourself) you put CLU between the Chip and IHS, then put Hydronaut between the IHS and Cooler? If your too scared to use CLU because you dont want to risk it getting on other parts of the chip and killing it, whats the next best thermal option to put between chip and IHS?
 
I really need to see some more testing on this whole delidding malarkey. I don't quite get it. Why is it that it's a "must" to put liquid metal between the die and HS but regular old thermal paste is fine between the HS and cooler? If the liquid metal doesn't make enough difference to warrant going on the cooler. (especially as you already have it). Then why does it warrant going on the die? I need to see numbers with Liquid metal on both and paste on both. I can't help but think there is a bit of "ooh i feel like an engineer" going on with the whole liquid metal process. Like it's not required but people thinks it makes them look cool and all techy by doing it. if that is NOT the case and it really makes a difference (is worth going to the effort of taking the HS off for) then why on earth is it not going between the HS and the cooler? Somethings not right here. Either it makes a big difference and should be on both the die and the HS or it doesnt, and just put thermal paste on the die.
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beany_bot said:
I really need to see some more testing on this whole delidding malarkey. I don't quite get it. Why is it that it's a "must" to put liquid metal between the die and HS but regular old thermal paste is fine between the HS and cooler? If the liquid metal doesn't make enough difference to warrant going on the cooler. (especially as you already have it). Then why does it warrant going on the die? I need to see numbers with Liquid metal on both and paste on both. I can't help but think there is a bit of "ooh i feel like an engineer" going on with the whole liquid metal process. Like it's not required but people thinks it makes them look cool and all techy by doing it. if that is NOT the case and it really makes a difference (is worth going to the effort of taking the HS off for) then why on earth is it not going between the HS and the cooler? Somethings not right here. Either it makes a big difference and should be on both the die and the HS or it doesnt, and just put thermal paste on the die.
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Its more of getting rid of the black adhesive crap intel use that creates a gap. I doubt you'd see much diff between thermal paste and liquid metal.
 
Marak said:
Did you use liquid metal? I did mine today and have about 25C lower temps on my 8350k. Corsair H80iv2 AIO.
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Hyper 212 off, put a H110i on this morning, MUCH better. Can now do 4.7Ghz with 1.32v (1.3v prime failed), Prime running 30mins, 3 cores temps mid 60's, core 3 hit 78 deg C. Cinebench 205, single thread is all I'm interested in for this build, so well happy I got this result out an ITX build and a CPU that costs £50 less than a 7600k. In future, can pop in a 8700k....who needs to wait for Zen 2 :)
 
You can use Conductanaut on the CPU IHS too. But its a bitch to get off. Can short out components if you get it anywhere else on the system and can damage the writing on the IHS top which invalidates warranty.
 
8 Pack said:
You can use Conductanaut on the CPU IHS too. But its a bitch to get off. Can short out components if you get it anywhere else on the system and can damage the writing on the IHS top which invalidates warranty.
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Correct me if I am wrong but aren't you more likely to short something out putting on the die (what with all the tiny capacitors around the die) than you are putting it between the IHS and cooler? And I assume your warranty is already void having pried the lid off and put liquid metal on the die.
 
I feel like part of the benefit of delidding comes from removal of the black gunk that holds the IHS on and closer contact between the die and IHS. This might be why 8Pack says he's had improvement in temps by delidding soldered CPUs.

The cooler is usually affixed to the IHS with a decent amount of pressure and not held off like the IHS is.

beany_bot said:
I really need to see some more testing on this whole delidding malarkey. I don't quite get it. Why is it that it's a "must" to put liquid metal between the die and HS but regular old thermal paste is fine between the HS and cooler? If the liquid metal doesn't make enough difference to warrant going on the cooler. (especially as you already have it). Then why does it warrant going on the die? I need to see numbers with Liquid metal on both and paste on both. I can't help but think there is a bit of "ooh i feel like an engineer" going on with the whole liquid metal process. Like it's not required but people thinks it makes them look cool and all techy by doing it. if that is NOT the case and it really makes a difference (is worth going to the effort of taking the HS off for) then why on earth is it not going between the HS and the cooler? Somethings not right here. Either it makes a big difference and should be on both the die and the HS or it doesnt, and just put thermal paste on the die.
Picture3.png
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E.g. https://imgur.com/j99z5lN
 
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8 Pack said:
You can use Conductanaut on the CPU IHS too. But its a bitch to get off. Can short out components if you get it anywhere else on the system and can damage the writing on the IHS top which invalidates warranty.
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Given that a delidded CPU has no intel warranty anyway, do you mean that a delidded 8pack CPU loses it's OcUK warranty if you use conductanaut on the IHS and the writing is damaged?
 
rtho782 said:
Given that a delidded CPU has no intel warranty anyway, do you mean that a delidded 8pack CPU loses it's OcUK warranty if you use conductanaut on the IHS and the writing is damaged?
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If you kill the chip because you used a conductive TIM I would think so. You could take out everything in the system. If we're talking about gallium based TIM it's also a pretty nasty corrosive. I wouldn't use any gallium based TIM.
 
rtho782 said:
I feel like part of the benefit of delidding comes from removal of the black gunk that holds the IHS on and closer contact between the die and IHS. This might be why 8Pack says he's had improvement in temps by delidding soldered CPUs.

The cooler is usually affixed to the IHS with a decent amount of pressure and not held off like the IHS is.



E.g. https://imgur.com/j99z5lN
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Nah I don't buy that. I've seen the thinness of the layer put on the die. it's tiny. Less even than the amount of paste between the IHS and cooler.
 
@chroniclard
Yep, the polymer TIM they use is a Dow Corning one that's optimized for long term stability rather than high thermal conductivity, so even if their current Coffee Lake application is good, any commercial performance TIM should do better.
 
I totally understand replacing Intels junk. What I dont understand is the practice of putting liquid metal on the die but not the cooler. Or indeed the practice of putting thermal paste on the cooler but not the die. Either this liquid metal makes a big enough difference to warrant being used. or it doesnt. regardless of which side of the IHS it's going on.
 
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