TiN from EVGA had a good comment on that whole situation and he knows a hell of a lot more about the makeup of the actual hardware than most of the youtubers ...... lifted it from the EVGA forums below ......
"Whole article is based on speculations of speculations. First of all, high-current DC-DC PDN (power delivery network) is real challenge, and indeed must use proper decoupling. However it does not mean that use of POSCAP/SPCAP or MLCC is the best in every case. Much more depends on transient tuning and VRM settings, and PCB layout itself, than using MLCC or POSCAP in specific spot. Just replacing everything with MLCCs will NOT help the design to reach higher speeds and stability. Why? Because one need to use all different caps in tandem, as their frequency response is different, as well as ESR, ESL and other factors.
Having everything with MLCC like glorified asus does means you have single deep resonance notch, instead of two less prominent notches when use MLCC+POSCAP together. Using three kinds, smaller POSCAP, bigger POSCAP, and some MLCCs gives better figure with 3 notches.. But again, with modern DC-DC controllers lot of this can be tuned from PID control and converter slew rate tweaks. This adjustability is one of big reasons why enthusiast cards often use "digital" that allows tweaking almost on the fly for such parameters. However this is almost never exposed to user, as wrong settings can easily make power phases go brrrrrr with smokes. Don't ask me how I know...
Everybody going nuts now with MLCC or POSCAP, but I didn't see a single note that actual boards used DIFFERENT capacitance and capacitor models, e.g. some use 220uF , some use 470uF
There are 680 or even 1000uF capacitors in D case on the market, that can be used behind GPU die. It is impossible to install that much of capacitance with MLCC in same spot for example, as largest cap in 0603 is 47uF for example.
Before looking onto poor 6 capacitors behind the die - why nobody talks about huge POSCAP capacitor bank behind VRM on FE card, eh? Custom AIB cards don't have that, just usual array without much of bulk capacitance. If I'd be designing a card, I'd look on a GPU's power demands and then add enough bulk capacitance first to make sure of good power impedance margin at mid-frequency ranges, while worrying about capacitors for high-frequency decoupling later, as that is relatively easier job to tweak.
After all these wild theories are easy to test, no need any engineering education to prove this wrong or right. Take "bad" crashing card with "bad POSCAPs", test it to confirm crashes... Then desolder "bad POSCAPs", put bunch of 47uF low-ESR MLCCs instead, and test again if its "fixed". Something tells me that it would not be such a simple case and card may still crash, heh.
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