I don't know about the performance of RDNA3 and i wouldn't get ahead of my self.
But i can expand on what i said earlier, we are getting to a point now where each die shrink offers less and less over the previous generation, a slowdown in More's law.
So the problem is to make more CPU or more GPU you have to keep making them bigger, look at the last few generations of Nvidia GPU's, aside from the cost of that you also have the laws of physics, the more transistors you pack in to these things the more electrical resistance you have, that drives up power consumption, again look at Nvidia, and Intel.
Now, wouldn't it be nice if you could split your big die up in to lots of little ones, your wafer yields would go up, they wouldn't have the electrical resistance problem so they are nice and efficient, like a small die chip, and if you do it right, like designing them to be modular, like logo, you can scale them infinitely, so the limits of how much CPU or GPU you can make no longer applies, the limit for how many cores you can have in a CPU is limited only by how big the PCB you glue them to is, 64 cores? no problem, 96? yeah, 128? done that..........
Can you imagine how big a monolithic CPU would need to be to accommodate 64 cores? Its why Intel can't do it, not even close, AMD have doubled that and they will double it again with Zen 5!
The problem with all that ^^^^ is there are A LOT of technical hurdles to overcome to make it work, AMD are the first to have done it, they might be the only ones....
IBM were the first and arguably the sony cell (a lisa su design), anyway global foundries when heavily in bed with AMD then purchased IBM microelectronics division (the firm I work for facilitated the exchange of IP back in the day)... The rest after that is history but if you follow Lisa's career back you can also trace her to IBM and early cpu design, in fact it's said that she is partly the reason why cpu's are designed the way they are today using copper trace rather than alloy interconnects she is also widely credited for her work developing silicon on insulator packaging.
Put it this way, Lisa was in and amongst mcm designs before mcm designs were even considered for x86. Put simply she is an extremely gifted engineer. Anyway thought you might be interested
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