The only thing that concerns me with the 7000 series X3D chips is that the original 5800X3D was more sensitive to temperatures and put out more heat than a regular 5800X and that was with a non-scuffed thick a$$ IHS
Yeah but the issue is more one of thermal density & thermal conductivity. Big AIO or not, it won't really matter that much. The real solution involves either delidding or at least lapping, sadly both very risky endeavours.It’s why I’m putting a big AIO on mine. The TDP is starting from a lower point which will also help.
I wonder if they'll keep the same design for Zen 5 or if they'll try to improve it. I reckon they'll stay the course since this will maintain compatibility better.