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AMD Zen 2 (Ryzen 3000) - *** NO COMPETITOR HINTING ***

Chiplets confirmed:

https://www.anandtech.com/show/13547/amd-next-horizon-live-blog-starts-9am-pt-5pm-utc

Jim from AdoredTV was correct. AVX256 confirmed.

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7NM Vega is in the MI60 card!

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That isn't how i read it, but the sound quality is rubbish. He was saying that Zen 2 has an uplift of 25% throughput. In my mind that reads IPC.................maybe i'm wrong on that though.

Yes he was talking about the front end, there is another video around somewhere, one of these tech people compared Zen internal operations to Skylake and found it to be a much more powerful CPU but bottlenecked by the front end.
They were talking about improvements to the front end, so yes the IPC should be UPTO ~24% higher.
 
That isn't how i read it, but the sound quality is rubbish. He was saying that Zen 2 has an uplift of 25% throughput. In my mind that reads IPC.................maybe i'm wrong on that though.
The GPU guy has just said exactly the same thing about Vega on 7nm tho.

That pretty much confirms they're just talking about process improvement. The odds of both the CPU and GPU having 25% perf improvement (total process + architecture) is pretty low.

Just reading it from here:

https://www.anandtech.com/show/13547/amd-next-horizon-live-blog-starts-9am-pt-5pm-utc
 
Yes he was talking about the front end, there is another video around somewhere, one of these tech people compared Zen internal operations to Skylake and found it to be a much more powerful CPU but bottlenecked by the front end.
They were talking about improvements to the front end, so yes the IPC should be UPTO ~24% higher.

I found the video

Its advisable you whatch all of this to understand what is going on.
The crocks of it is Zen is a more powerful architecture than Skylake but bottlenecked by the front-end.
Improvements to that front end unlocks more IPC in the CPU, it appears that's what AMD have been doing with Zen 2, working on improving the front-end resulting in upto 25% higher IPC, probably more like 15% on average.

 
Thats the server, and at HALF the power consumption....
What are you talking about?

One guy is talking about Zen for datacentre, the other guy is talking about Vega for datacentre.

They're both "server" products. Both guys gave the same stats for process improvement:

Double density.
50% power at same perf.
1.25x perf at same power.

These are clearly process metrics. Density is only relevant to process.
 
The biggest thing is the chiplet design which is revolutionary.

By keeping the I/O and memory controller,etc on a central chip made on a older node,it will drop costs a lot. Making the CPU dies on 7NM,means those chiplets will be tiny,high yielding and lower cost.

Also by keeping the memory controller on the central die,it should help drop latency too.
 
Yes he was talking about the front end, there is another video around somewhere, one of these tech people compared Zen internal operations to Skylake and found it to be a much more powerful CPU but bottlenecked by the front end.
They were talking about improvements to the front end, so yes the IPC should be UPTO ~24% higher.

If that turns out to be true and we see all core speeds rise to 4.8Ghz............................then Intel will be dead in the water. The IPC lead they have now is not that much over a 2700x, a 3700x clocked at 4.8Ghz all cores with a 24/25% increase in IPC will eat a 9900K for breakfast and come back for afters.
 
If that turns out to be true and we see all core speeds rise to 4.8Ghz............................then Intel will be dead in the water. The IPC lead they have now is not that much over a 2700x, a 3700x clocked at 4.8Ghz all cores with a 24/25% increase in IPC will eat a 9900K for breakfast and come back for afters.

Right. Zen+ IPC is pretty much identical to Coffeelake, Including most game, there are outliers of old games that really don't understand Zen at all, like CSGO for example, Arma III was just like that until it got a Zen patch and now its on par with Coffeelake, you look at all modern titles where the CPU is the bottleneck Zen+ performance is pretty much relative to Coffeelake clock speed.
Things like Cinebench its +3% to Coffeelake ST and +4% to Zen+ MT with the same number of threads.

With +15% IPC and 4.8Ghz the 9900K falls behind the Zen 2 eight core.
 
The chiplet is probably going to be under 80MM2!! The yields should be great and it should lower costs.

Right. Zen+ IPC is pretty much identical to Coffeelake, Including most game, there are outliers of old games that really don't understand Zen at all, like CSGO for example, Arma III was just like that until it got a Zen patch and now its on par with Coffeelake, you look at all modern titles where the CPU is the bottleneck Zen+ performance is pretty much relative to Coffeelake clock speed.
Things like Cinebench its +3% to Coffeelake ST and +4% to Zen+ MT with the same number of threads.

With +15% IPC and 4.8Ghz the 9900K falls behind the Zen 2 eight core.

Well latency too had an effect on certain applications,but by moving everything to a central controller chip,this might drop it even more?

Also AMD can use GF to make the controller chips and TSMC the chiplets.

WSA and high performance sorted!!
 
When i started watching the live feed he was talking about Zen and Epyc, so i was not shure if he meant both Zen2 and Epyc would both have chiplets or just Epyc as Adored mentioned a while ago.
 
The chiplet is probably going to be under 80MM2!! The yields should be great and it should lower costs.

Intel just launched their 48 core CPU to compete with AMD, its two 24 core CPUs on a single package.

I don't know much about it but it appears to be two Skylake-X CPUs Glued :D to an interposer, much like their old Core 2 Extreme from back in the day, picture of that in the spoiler.

szhXGIr.jpg.png

I do think what Intel did here was put two 24 Core CPU's onto an interposer substrate and call it a 48 core CPU, its not, its two 24 core CPU's.
 
Intel just launched their 48 core CPU to compete with AMD, its two 24 core CPUs on a single package.

I don't know much about it but it appears to be two Skylake-X CPUs Glued :D to an interposer, much like their old Core 2 Extreme from back in the day, picture of that in the spoiler.

szhXGIr.jpg.png

I do think what Intel did here was put two 24 Core CPU's onto an interposer substrate and call it a 48 core CPU, its not, its two 24 core CPU's.

isn't that a Q6600?
 
When i started watching the live feed he was talking about Zen and Epyc, so i was not shure if he meant both Zen2 and Epyc would both have chiplets or just Epyc as Adored mentioned a while ago.
Having uncore in same die would make more sense for desktop.
It's easier to make high speed bus the shorter the distance.

EDIT:
Though I wonder if they could be increasing core count of single CCX and having different CCXes on own dies...
With uncore taken out they might shrink 8 cores into single small die, without inter core communication latency increase from going to other four cores in different CCX.

I don't know much about it but it appears to be two Skylake-X CPUs Glued :D to an interposer, much like their old Core 2 Extreme from back in the day, picture of that in the spoiler.
I can already see "The Way It's Meant to be Glued" marketing campaign from Intel...
Or maybe they'll be using bubblegum which won't get used when Intel had to start soldering heatspreader.
 
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