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AMD Zen 2 (Ryzen 3000) - *** NO COMPETITOR HINTING ***

Lisa already confirmed the Ryzen 3xxx package doesn't support a GPU module in the 2nd CCX position. I'd assume a different substrate package would be required for that, which certainly isn't out of the question with the chiplet design.
Yes that's true but a future Renoir APU is not going to be a complete redesign, the package will surely look very similar to Matisse and if they want an 8 core APU they'll need to have 8 cores on a single chiplet working (same with 16 core CPU and 64 core EPYC).
 
Here's a thought: the CES demo was a single chiplet 8-0 configuration. If, as expected, AMD also introduce double chiplet versions, does that mean 8 core variants will be 8-0 in final silicon, or will they be 4-4? It seems like the choice would depend on yields. If they have numerous chiplets with <6 usable cores then 4-4 would allow them to use more of those defective dies.
Chiplet die is such small that I doubt they'll have much of them with more than one broken core.
And with die size below half the usual, yields are likely such that single chiplet 8 core is at least under consideration.
Wouldn't even have to be the highest clocking/most energy efficient dies, if 8 core CPUs are going to be mid range models.
 
Here's a thought: the CES demo was a single chiplet 8-0 configuration. If, as expected, AMD also introduce double chiplet versions, does that mean 8 core variants will be 8-0 in final silicon, or will they be 4-4? It seems like the choice would depend on yields. If they have numerous chiplets with <6 usable cores then 4-4 would allow them to use more of those defective dies. However, if that isn't the case then they might stick with 8-0 for simplicity: it would mean a potential 8 core APU would simply mean swapping out a dead/dummy chiplet for a GPU chiplet.

Also, if they do end up with 4-4 (or even 3-3 for the 6 core variants and 2-2 for the 4 core Athlons), will it affect overall performance compared to the 8-0 demo we saw? The answer probably lies in what improvements they've made to infinity fabric but I suspect it would take a small performance hit.

And quite importantly, how do we tell as consumers without de-lidding?

I think you're right about the possibility of any number of combinations - no matter the die size you still get flaws, so it'll depend on what the market demand is as to whether they also produce 6+2, 4+4 or whatever. On the otherhand, just going with one chiplet will be cheaper if they don't need to scavenge for yield.

I'm interested to see how the northbridge/IO chiplet interacts with the motherboard. It's already backwards compatible, so is it in effect emulating an on-die memory controller as far as the motherboard/RAM is concerned? If so, is there scope for future improvement if you design a motherboard chipset around this new design exclusively without being compatible with previous chips?
 
Just read that intel are releasing the 9900k but with the GPU disabled but for the same price as the original looks like AMD are going to have a fantastic year if that's the case as it just shows intel have absolutely nothing to offer to counter AMD
 
I'm interested to see how the northbridge/IO chiplet interacts with the motherboard. It's already backwards compatible, so is it in effect emulating an on-die memory controller as far as the motherboard/RAM is concerned? If so, is there scope for future improvement if you design a motherboard chipset around this new design exclusively without being compatible with previous chips?

It is completely invisible to the motherboard, since Zen design is an SoC. The CPU and Memory still interact in the same manner as previously, maybe with a small increase in latency, but that will have to be confirmed on release.
 
I think you're right about the possibility of any number of combinations - no matter the die size you still get flaws, so it'll depend on what the market demand is as to whether they also produce 6+2, 4+4 or whatever. On the otherhand, just going with one chiplet will be cheaper if they don't need to scavenge for yield.

Also costs, is it cheaper to throw away a defective piece of silicon or pay for it to be fitted to the substrate.
 
It is completely invisible to the motherboard, since Zen design is an SoC. The CPU and Memory still interact in the same manner as previously, maybe with a small increase in latency, but that will have to be confirmed on release.
Yep, currently. I'm just wondering if there's room for optimisation if they can break from the current manner of interaction.
 
Yep, currently. I'm just wondering if there's room for optimisation if they can break from the current manner of interaction.

Yes, but that has nothing at at to do with the motherboard, as per your original question. I am sure that AMD will have designed the layout as best as they can for the first generation split die chiplet approach, one of those ways is to increase cache sizes which we'll have confirmed once they announce the CPU's specifications at some point in the near future.
 
I had an old Phenom II x 2 550BE and that was based off a failed Quad. I managed to enable core 4 and have a tri-core processor. :p

I had one of those as well and it actually unlocked to a full quad core. Granted I could only overclock it to 3.4Ghz which was significantly slower than the fully fledged X4 955's which could reach 3.8-4Ghz...at double the price :p
 
When are these coming out roughly? Got my eye on the Ryzen 7 3700X 12 core CPU. At 5GHz it will finally be a sweet upgrade over my aging (but still very capable 4770K) :D

Should be about £300. So for a mobo and ram combo we are talking around £700?

Was thinking 16gb is still enough as this build will be purchased with keeping in mind to pass it down in 3 years time to a lighter user.
 
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When are these coming out roughly? Got my eye on the Ryzen 7 3700X 12 core CPU. At 5GHz it will finally be a sweet upgrade over my aging (but still very capable 4770K) :D

Should be about £300. So for a mobile and ram combo we are talking around £700?

Was thinking 16gb is still enough as this build will be purchased with keeping in mind to pass it down in 3 years time to a lighter user.

April-June, most likely May. I'd expect it to be £329 if it exists. :)
 
When are these coming out roughly? Got my eye on the Ryzen 7 3700X 12 core CPU. At 5GHz it will finally be a sweet upgrade over my aging (but still very capable 4770K) :D

Should be about £300. So for a mobile and ram combo we are talking around £700?

Was thinking 16gb is still enough as this build will be purchased with keeping in mind to pass it down in 3 years time to a lighter user.

Keep in mind that the product you are talking about is pure speculation right now. It is looking like possibly May, probably June or July for release.
 
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